Datasheet Texas Instruments MSP430F5358IPZR

ManufacturerTexas Instruments
SeriesMSP430F5358
Part NumberMSP430F5358IPZR
Datasheet Texas Instruments MSP430F5358IPZR

MSP430F53xx Mixed Signal Microcontroller 100-LQFP -40 to 85

Datasheets

MSP430F665x, MSP430F645x, MSP430F565x, MSP430F535x Mixed Signal Microcontroller datasheet
PDF, 1.9 Mb, Revision: C, File published: Oct 21, 2013
Extract from the document

Prices

Status

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

Packaging

Pin100
Package TypePZ
Industry STD TermLQFP
JEDEC CodeS-PQFP-G
Package QTY1000
CarrierLARGE T&R
Device MarkingF5358
Width (mm)14
Length (mm)14
Thickness (mm)1.4
Pitch (mm).5
Max Height (mm)1.6
Mechanical DataDownload

Parametrics

ADCADC12 - 12ch
AESN/A
Active Power370 uA/MHz
Additional FeaturesReal-Time Clock,Watchdog,DAC,Temp Sensor,Brown Out Reset,IrDA
BSLUART
CPUMSP430
Comparators12
DMA6
Featuredf5
Frequency20 MHz
GPIO Pins74
I2C3
Max VCC3.6
Min VCC1.8
Multiplier32x32
Non-volatile Memory384 KB
Operating Temperature Range-40 to 85 C
Package GroupLQFP
Package Size: mm2:W x L100LQFP: 256 mm2: 16 x 16(LQFP) PKG
RAM34 KB
RatingCatalog
SPI6
Special I/ON/A
Standby Power2.6 LPM3-uA
Timers - 16-bit4
UART3
Wakeup Time3 us

Eco Plan

RoHSCompliant

Design Kits & Evaluation Modules

  • Evaluation Modules & Boards: MSP-TS430PZ100C
    MSP-TS430PZ100C - 100-pin Target Development Board for MSP430F5x and MSP430F6x MCUs
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: MSP-EXP430F5529LP
    MSP430F5529 USB LaunchPad Evaluation Kit
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: ENERGYTRACE
    MSP EnergyTrace Technology
    Lifecycle Status: Active (Recommended for new designs)

Application Notes

  • Using the MSP430 RTC_B Module With Battery Backup Supply (Rev. B)
    PDF, 135 Kb, Revision: B, File published: Jun 4, 2015
    Some applications need to retain an accurate real-time clock (RTC) through battery changes, power outages, and other events. For these applications, MSP430в„ў devices that contain the RTC_B Real-Time Clock module with a Battery Backup System can be a great fit. This application note demonstrates how to use RTC_B with Battery Backup Supply functionality to retain the time and keep the RTC counting th
  • Using the MSP430 Timer_D Module in Hi-Resolution Mode
    PDF, 870 Kb, File published: Oct 2, 2013
    This application report describes the use of the high-resolution feature of the Timer_D module introduced in MSP430F51x1 and MSP430F51x2 devices. Timer_D enables applications that require high resolution such as capacitive touch detection, PWM DACs, advanced LED lighting, and digital controllers for power supplies. This application report provides an advanced description of the use and calibration
  • General Oversampling of MSP ADCs for Higher Resolution (Rev. A)
    PDF, 551 Kb, Revision: A, File published: Apr 1, 2016
    Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl
  • MSP Code Protection Features
    PDF, 752 Kb, File published: Dec 7, 2015
    MSP microcontrollers (MCUs) offer a number of features to help control code accessibility in the device, to add different layers of code access management and protection strategies. These include features that can lock or password protect the JTAG/SBW access, IP Encapsulation (IPE) to isolate sensitive code with different permissions than the rest of the program, and bootloader (BSL) access featur
  • ESD Diode Current Specification
    PDF, 520 Kb, File published: Dec 7, 2015
    This document explains the maximum ESD diode current specified for GPIO on MSP microcontrollers. Sometimes signals on specific pins exceed the supply of the MSP MCU. In such a case, the device can handle this overvoltage condition through the ESD diodes, but the ESD diode specification must be considered during application design. The items to be considered are described in this document.

Model Line

Manufacturer's Classification

  • Semiconductors > Microcontrollers (MCU) > MSP430 ultra-low-power MCUs > MSP430F5x/6x
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