Datasheet Texas Instruments LM2585

Manufacturer	Texas Instruments
Series	LM2585

Datasheets

Prices

Status

Packaging

Parametrics

Parameters / Models	LM2585S-12/NOPB	LM2585S-3.3/NOPB	LM2585S-5.0/NOPB	LM2585S-ADJ	LM2585S-ADJ/NOPB	LM2585SX-12/NOPB	LM2585SX-5.0	LM2585SX-5.0/NOPB	LM2585SX-ADJ	LM2585SX-ADJ/NOPB	LM2585T-12/NOPB	LM2585T-3.3/NOPB	LM2585T-5.0/NOPB	LM2585T-ADJ	LM2585T-ADJ/NOPB
Approx. Price (US$)									3.00 | 1ku
Duty Cycle(Max), %	98	98	98	98	98	98	98	98		98	98	98	98	98	98
Duty Cycle(Max)(%)									98
Iq(Typ), mA	11	11	11	11	11	11	11	11		11	11	11	11	11	11
Iq(Typ)(mA)									11
Operating Temperature Range, C	-40 to 125	-40 to 125	-40 to 125	-40 to 125	-40 to 125	-40 to 125	-40 to 125	-40 to 125		-40 to 125	-40 to 125	-40 to 125	-40 to 125	-40 to 125	-40 to 125
Operating Temperature Range(C)									-40 to 125
Package Group	DDPAK/TO-263	DDPAK/TO-263	DDPAK/TO-263	DDPAK/TO-263	DDPAK/TO-263	DDPAK/TO-263	DDPAK/TO-263	DDPAK/TO-263	DDPAK/TO-263	DDPAK/TO-263	TO-220	TO-220	TO-220	TO-220	TO-220
Rating	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog
Regulated Outputs	1	1	1	1	1	1	1	1		1	1	1	1	1	1
Regulated Outputs(#)									1
Switch Current Limit(Min), A	3	3	3	3	3	3	3	3		3	3	3	3	3	3
Switch Current Limit(Min)(A)									3
Switch Current Limit(Typ), A	4	4	4	4	4	4	4	4		4	4	4	4	4	4
Switch Current Limit(Typ)(A)									4
Switching Frequency(Max), kHz	115	115	115	115	115	115	115	115		115	115	115	115	115	115
Switching Frequency(Max)(kHz)									115
Switching Frequency(Min), kHz	85	85	85	85	85	85	85	85		85	85	85	85	85	85
Switching Frequency(Min)(kHz)									85
Type	Converter	Converter	Converter	Converter	Converter	Converter	Converter	Converter	Converter	Converter	Converter	Converter	Converter	Converter	Converter
Vin(Max), V	40	40	40	40	40	40	40	40		40	40	40	40	40	40
Vin(Max)(V)									40
Vin(Min), V	4	4	4	4	4	4	4	4		4	4	4	4	4	4
Vin(Min)(V)									4
Vout(Max), V	60	60	60	60	60	60	60	60		60	60	60	60	60	60
Vout(Max)(V)									60
Vout(Min), V	1.23	1.23	1.23	1.23	1.23	1.23	1.23	1.23		1.23	1.23	1.23	1.23	1.23	1.23
Vout(Min)(V)									1.23

Eco Plan

Application Notes

• Download
  Softstart Using Constant Current Constant Voltage Approach
  PDF, 337 Kb, File published: Jul 24, 2015
  In many systems backup power is provided either by batteries or simply by a large value capacitor. Inthese applications the capacitor would only provide the current when the primary power source fails.Further, these applications are usually for light load currents. During normal operation the backupcapacitors are kept charged up by a DC/DC converter. The challenge involved in an application
• Download
  AN-643 EMI/RFI Board Design (Rev. B)
  PDF, 742 Kb, Revision: B, File published: May 3, 2004
  Application Note 643 EMI/RFI Board Design
• Download
  Working With Boost Converters
  PDF, 159 Kb, File published: Jun 15, 2015
  This brief note highlights some of the more common pitfalls when using boost regulators. These includemaximum achievable output current and voltage, short circuit behavior and basic layout issues. It isassumed that the reader is familiar with the basic operation of a boost regulator.
• Download
  Input and Output Capacitor Selection
  PDF, 219 Kb, File published: Sep 19, 2005
• Download
  Basic Calculation of a Boost Converter's Power Stage (Rev. C)
  PDF, 186 Kb, Revision: C, File published: Jan 8, 2014
  This application note gives the equations to calculate the power stage of a boost converter built with an IC with integrated switch and operating in continuous conduction mode. It is not intended to give details on the functionality of a boost converter (see Reference 1) or how to compensate a converter. See the references at the end of this document if more detail is needed.
• Download
  AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)
  PDF, 3.6 Mb, Revision: A, File published: Apr 23, 2013
  This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
• Download
  AN-1566 Techniques for Thermal Analysis of Switching Power Supply Designs (Rev. A)
  PDF, 1.4 Mb, Revision: A, File published: Apr 23, 2013
  This application note provides thermal power analysis techniques for analyzing the power IC.
• Download
  AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)
  PDF, 2.7 Mb, Revision: A, File published: Apr 23, 2013
  This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time.
• Download
  Semiconductor and IC Package Thermal Metrics (Rev. C)
  PDF, 201 Kb, Revision: C, File published: Apr 19, 2016
• Download
  Inverted SEPIC Made SIMPLE
  PDF, 408 Kb, File published: Jul 31, 2015
  There can be quite a few applications that require a conversion from a negative input voltage to a negativeoutput voltage and there are a few ways to go about doing it. The telecom industry is one such examplewhere the rails are usually negative. This design space along with being limited is not well explored. In thisapplication note we will go over the use of an integrated boost regulator i
• Download
  AN-1082 Adjust or Synchronize LM2586/88 Switching Frequency (Rev. B)
  PDF, 69 Kb, Revision: B, File published: Apr 23, 2013
  Switching frequency is a very important parameter in switching power converters. As the switchingfrequency increases, the physical size of magnetic elements and other components in the circuit reducesignificantly. Switching frequency also plays a great role in control loop gain and compensation design.Switching frequency determines the maximum allowable bandwidth of the control loop. Switchi
• Download
  AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)
  PDF, 82 Kb, Revision: C, File published: Apr 23, 2013
  When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current
• Download
  Understanding Boost Power Stages In Switchmode Power Supplies
  PDF, 149 Kb, File published: Mar 4, 1999
  A switching power supply consists of the power stage and the control circuit. The power stage performs the basic power conversion from the input voltage to the output voltage and includes switches and the output filter. This report addresses the boost power stage only and does not cover control circuits. The report includes detailed steady-stage and small-signal analysis of the boost power stage o
• Download
  AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)
  PDF, 374 Kb, Revision: C, File published: Apr 23, 2013
  This application report provides SIMPLE SWITCHER™ PCB layout guidelines.
• Download
  AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
  PDF, 2.5 Mb, Revision: C, File published: Apr 24, 2013
  Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
• Download
  AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
  PDF, 9.2 Mb, Revision: B, File published: Apr 23, 2013
  This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP

Model Line

Manufacturer's Classification

• Semiconductors> Power Management> Non-isolated DC/DC Switching Regulator> Step-Up (Boost)> Boost Converter (Integrated Switch)