Datasheet Texas Instruments MSP430G2230-EP
| Manufacturer | Texas Instruments |
| Series | MSP430G2230-EP |
Enhanced Product 16-bit Ultra-Low-Power Mixed Signal Microcontroller, 2kB Flash, 128B RAM
Datasheets
MSP430G2230-EP Mixed Signal Microcontroller datasheet
PDF, 997 Kb, File published: Aug 16, 2012
Extract from the document
Prices
Status
| MSP430G2230QDEP | MSP430G2230QDREP | V62/12620-01XE | V62/12620-01XE-T | |
|---|---|---|---|---|
| Lifecycle Status | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) |
| Manufacture's Sample Availability | No | Yes | No | Yes |
Packaging
| MSP430G2230QDEP | MSP430G2230QDREP | V62/12620-01XE | V62/12620-01XE-T | |
|---|---|---|---|---|
| N | 1 | 2 | 3 | 4 |
| Pin | 8 | 8 | 8 | 8 |
| Package Type | D | D | D | D |
| Industry STD Term | SOIC | SOIC | SOIC | SOIC |
| JEDEC Code | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G |
| Package QTY | 75 | 2500 | 2500 | 75 |
| Carrier | TUBE | LARGE T&R | LARGE T&R | TUBE |
| Device Marking | G230EP | G230EP | G230EP | G230EP |
| Width (mm) | 3.91 | 3.91 | 3.91 | 3.91 |
| Length (mm) | 4.9 | 4.9 | 4.9 | 4.9 |
| Thickness (mm) | 1.58 | 1.58 | 1.58 | 1.58 |
| Pitch (mm) | 1.27 | 1.27 | 1.27 | 1.27 |
| Max Height (mm) | 1.75 | 1.75 | 1.75 | 1.75 |
| Mechanical Data | Download | Download | Download | Download |
Parametrics
| Parameters / Models | MSP430G2230QDEP | MSP430G2230QDREP | V62/12620-01XE | V62/12620-01XE-T |
|---|---|---|---|---|
| ADC | ADC10 - 4ch | ADC10 - 4ch | ADC10 - 4ch | ADC10 - 4ch |
| AES | N/A | N/A | N/A | N/A |
| Active Power, uA/MHz | 220 | 220 | 220 | 220 |
| Additional Features | Watchdog,Temp Sensor,Brown Out Reset | Watchdog,Temp Sensor,Brown Out Reset | Watchdog,Temp Sensor,Brown Out Reset | Watchdog,Temp Sensor,Brown Out Reset |
| BSL | I2C | I2C | I2C | I2C |
| CPU | MSP430 | MSP430 | MSP430 | MSP430 |
| DMA | 1 | 1 | 1 | 1 |
| Frequency, MHz | 16 | 16 | 16 | 16 |
| GPIO | 4 | 4 | 4 | 4 |
| I2C | 1 | 1 | 1 | 1 |
| Max VCC | 3.6 | 3.6 | 3.6 | 3.6 |
| Min VCC | 1.8 | 1.8 | 1.8 | 1.8 |
| Multiplier | N/A | N/A | N/A | N/A |
| Non-volatile Memory, KB | 2 | 2 | 2 | 2 |
| Operating Temperature Range, C | -40 to 125 | -40 to 125 | -40 to 125 | -40 to 125 |
| Package Group | SOIC | SOIC | SOIC | SOIC |
| Package Size: mm2:W x L, PKG | 8SOIC: 29 mm2: 6 x 4.9(SOIC) | 8SOIC: 29 mm2: 6 x 4.9(SOIC) | 8SOIC: 29 mm2: 6 x 4.9(SOIC) | 8SOIC: 29 mm2: 6 x 4.9(SOIC) |
| RAM, KB | 0.125 | 0.125 | 0.125 | 0.125 |
| Rating | HiRel Enhanced Product | HiRel Enhanced Product | HiRel Enhanced Product | HiRel Enhanced Product |
| SPI | 1 | 1 | 1 | 1 |
| Special I/O | N/A | N/A | N/A | N/A |
| Standby Power, LPM3-uA | 0.5 | 0.5 | 0.5 | 0.5 |
| Timers - 16-bit | 1 | 1 | 1 | 1 |
| Wakeup Time, us | 1 | 1 | 1 | 1 |
Eco Plan
| MSP430G2230QDEP | MSP430G2230QDREP | V62/12620-01XE | V62/12620-01XE-T | |
|---|---|---|---|---|
| RoHS | Compliant | Compliant | Compliant | Compliant |
Application Notes
- Migrating From MSP430 F2xx and G2xx Families to MSP430 FR4xx and FR2xx Family (Rev. E)PDF, 237 Kb, Revision: E, File published: May 4, 2018
This application report helps to ease the migration from MSP430F2xx flash-based MCUs to the MSP430FR4xx and MSP430FR2xx family of FRAM-based MCUs. It discusses programming system hardware core architecture and peripheral considerations. The intent is to highlight key differences between the two families. For more information on the use of the MSP430FR4xx and MSP430FR2xx devices see the MSP430
Model Line
Series: MSP430G2230-EP (4)
Manufacturer's Classification
- Semiconductors> Space & High Reliability> Microcontroller> Low Power MCU> MSP430 MCU
