Datasheet Texas Instruments SN74CBT3126

ManufacturerTexas Instruments
SeriesSN74CBT3126
Datasheet Texas Instruments SN74CBT3126

Quadruple FET Bus Switch

Datasheets

SN74CBT3126 datasheet
PDF, 1.4 Mb, Revision: K, File published: Oct 6, 2003
Extract from the document

Prices

Status

SN74CBT3126DSN74CBT3126DBQRSN74CBT3126DBQRE4SN74CBT3126DBQRG4SN74CBT3126DBRSN74CBT3126DG4SN74CBT3126DRSN74CBT3126DRG4SN74CBT3126PWSN74CBT3126PWRSN74CBT3126PWRG4SN74CBT3126RGYR
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNoNoNoNoNoNoNoNoNoNo

Packaging

SN74CBT3126DSN74CBT3126DBQRSN74CBT3126DBQRE4SN74CBT3126DBQRG4SN74CBT3126DBRSN74CBT3126DG4SN74CBT3126DRSN74CBT3126DRG4SN74CBT3126PWSN74CBT3126PWRSN74CBT3126PWRG4SN74CBT3126RGYR
N123456789101112
Pin141616161414141414141414
Package TypeDDBQDBQDBQDBDDDPWPWPWRGY
Industry STD TermSOICSSOPSSOPSSOPSSOPSOICSOICSOICTSSOPTSSOPTSSOPVQFN
JEDEC CodeR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GS-PQFP-N
Package QTY502500250025002000502500250090200020003000
CarrierTUBELARGE T&RLARGE T&RLARGE T&RLARGE T&RTUBELARGE T&RLARGE T&RTUBELARGE T&RLARGE T&RLARGE T&R
Device MarkingCBT3126CU126CU126CU126CU126CBT3126CBT3126CBT3126CU126CU126CU126CU126
Width (mm)3.913.93.93.95.33.913.913.914.44.44.43.5
Length (mm)8.654.94.94.96.28.658.658.655553.5
Thickness (mm)1.581.51.51.51.951.581.581.58111.9
Pitch (mm)1.27.64.64.64.651.271.271.27.65.65.65.5
Max Height (mm)1.751.751.751.7521.751.751.751.21.21.21
Mechanical DataDownloadDownloadDownloadDownloadDownloadDownloadDownloadDownloadDownloadDownloadDownloadDownload

Parametrics

Parameters / ModelsSN74CBT3126D
SN74CBT3126D
SN74CBT3126DBQR
SN74CBT3126DBQR
SN74CBT3126DBQRE4
SN74CBT3126DBQRE4
SN74CBT3126DBQRG4
SN74CBT3126DBQRG4
SN74CBT3126DBR
SN74CBT3126DBR
SN74CBT3126DG4
SN74CBT3126DG4
SN74CBT3126DR
SN74CBT3126DR
SN74CBT3126DRG4
SN74CBT3126DRG4
SN74CBT3126PW
SN74CBT3126PW
SN74CBT3126PWR
SN74CBT3126PWR
SN74CBT3126PWRG4
SN74CBT3126PWRG4
SN74CBT3126RGYR
SN74CBT3126RGYR
Bandwidth, MHz200200200200200200200200200200200200
Configuration1:1 SPST1:1 SPST1:1 SPST1:1 SPST1:1 SPST1:1 SPST1:1 SPST1:1 SPST1:1 SPST1:1 SPST1:1 SPST1:1 SPST
Input/Ouput Voltage(Max), V5.55.55.55.55.55.55.55.55.55.55.55.5
Input/Output Continuous Current(Max), mA128128128128128128128128128128128128
Input/Output OFF-state Capacitance(Typ), pF444444444444
Number of Channels444444444444
OFF-state leakage current(Max), µA111111111111
ON-state leakage current(Max), µA111111111111
Operating Temperature Range, C-40 to 85-40 to 85-40 to 85-40 to 85-40 to 85-40 to 85-40 to 85-40 to 85-40 to 85-40 to 85-40 to 85-40 to 85
Package GroupSOICSSOPSSOPSSOPSSOPSOICSOICSOICTSSOPTSSOPTSSOPVQFN
Package Size: mm2:W x L, PKG14SOIC: 52 mm2: 6 x 8.65(SOIC)16SSOP: 19 mm2: 3.9 x 4.9(SSOP)16SSOP: 19 mm2: 3.9 x 4.9(SSOP)16SSOP: 19 mm2: 3.9 x 4.9(SSOP)16SSOP: 19 mm2: 3.9 x 4.9(SSOP)14SOIC: 52 mm2: 6 x 8.65(SOIC)14SOIC: 52 mm2: 6 x 8.65(SOIC)14SOIC: 52 mm2: 6 x 8.65(SOIC)14TSSOP: 32 mm2: 6.4 x 5(TSSOP)14TSSOP: 32 mm2: 6.4 x 5(TSSOP)14TSSOP: 32 mm2: 6.4 x 5(TSSOP)14VQFN: 12 mm2: 3.5 x 3.5(VQFN)
RatingCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalog
Ron(Max), Ohms222222222222222222222222
Ron(Typ), Ohms555555555555
Supply Current(Max), uA666666666666
Supply Range, Max5.55.55.55.55.55.55.55.55.55.55.55.5
VIH(Min), V222222222222
VIL(Max), V0.80.80.80.80.80.80.80.80.80.80.80.8
Vdd(Max), V5.55.55.55.55.55.55.55.55.55.55.55.5
Vdd(Min), V444444444444
Vss(Max), VN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/A
Vss(Min), VN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/A

Eco Plan

SN74CBT3126DSN74CBT3126DBQRSN74CBT3126DBQRE4SN74CBT3126DBQRG4SN74CBT3126DBRSN74CBT3126DG4SN74CBT3126DRSN74CBT3126DRG4SN74CBT3126PWSN74CBT3126PWRSN74CBT3126PWRG4SN74CBT3126RGYR
RoHSCompliantCompliantCompliantCompliantCompliantCompliantCompliantCompliantCompliantCompliantCompliantCompliant

Application Notes

  • Optical Implementation Using IEEE-1394.b (Rev. A)
    PDF, 133 Kb, Revision: A, File published: Mar 1, 2004
    IEEE Std 1394b-2002 specification allows the use of optical media for longer distances at higher speeds. The use of optical media provides galvanic isolation, lower electromagnetic interference (EMI), and lower interference from the environment.Interfacing 1394.b physical-layer devices (PHYs) may require additional components, depending on the type of fiber-optic transceiver (FOT) selected. Th
  • Flexible Voltage-Level Translation With CBT Family Devices
    PDF, 40 Kb, File published: Jul 20, 1999
    Voltage translation between buses with incompatible logic levels can be accomplished using Texas Instruments (TI) translation-voltage clamps (TVC) or standard crossbar technology (CBT) devices. CBT devices in this application offer flexibility in designs, protection of circuits that are sensitive to high-state voltage-level overshoots, and cost efficiency.
  • 5-V To 3.3-V Translation With the SN74CBTD3384 (Rev. B)
    PDF, 35 Kb, Revision: B, File published: Mar 1, 1997
    The emergence of low-voltage technology required existing 5-V systems to interact with 3.3-V systems. Compatibility issues of mixed-mode operation created the need for 5-V to 3.3-V translation. Buffers and transceivers serve as effective translators. While providing additional drive, these devices also add propagation delay and require directional control. In cases where additional drive is not
  • 3.3-V to 2.5-V Translation with Texas Instruments Crossbar Technology (Rev. A)
    PDF, 32 Kb, Revision: A, File published: Apr 3, 1998
  • VOLTAGE LEVEL TRANSLATION (SL) - Family
    PDF, 111 Kb, File published: Sep 21, 2011
  • Bus FET Switch Solutions for Live Insertion Applications
    PDF, 300 Kb, File published: Feb 7, 2003
    In today?s competitive computing and networking industry, any equipment downtime due to component interconnects or bus failures impedes communication, hinders productivity and hampers financial growth. In recognizing this increasingly costly unplanned downtime, the industry introduced live-insertion technology to minimize the impact of any such failures. The live-insertion feature enables a networ
  • 16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
    PDF, 895 Kb, Revision: B, File published: May 22, 2002
    TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa

Model Line

Manufacturer's Classification

  • Semiconductors> Switches and Multiplexers> Analog Switches/Muxes
EMS supplier