Datasheet ES1H - Multicomp DIODE, ULTRA-FAST, 1 A, 500 V

Multicomp ES1H

Part Number: ES1H

Detailed Description

Manufacturer: Multicomp

Description: DIODE, ULTRA-FAST, 1 A, 500 V

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Docket:
ES1x Series
Features:
· · · · · · · · · · Glass passivated junction chip.

For surface mounted application. Low profile package. Built-in strain relief. Ideal for automated placement. Easy pick and place. Super fast recovery time for high efficiency. Glass passivated chip junction. High temperature soldering: 260°C/10 seconds at terminals. Plastic material.
SMA/DO-214AC
Dimensions : Inches (Millimetres)

Specifications:

  • Current Ifsm: 30 A
  • Diode Type: Fast Recovery
  • External Depth: 2.50 mm
  • External Length / Height: 2.83 mm
  • External Width: 4.60 mm
  • Forward Current If Max: 1 A
  • Forward Current If(AV): 1 A
  • Forward Surge Current Ifsm Max: 30 A
  • Forward Voltage VF Max: 1.7 V
  • Forward Voltage: 1.7 V
  • Junction Temperature Tj Max: 150°C
  • Junction Temperature Tj Min: -55°C
  • Junction to Case Thermal Resistance A: 85 °C/W
  • Mounting Type: SMD
  • Number of Pins: 2
  • Operating Temperature Range: -55°C to +150°C
  • Package / Case: DO-214AC
  • Repetitive Reverse Voltage Vrrm Max: 500 V
  • Reverse Recovery Time trr Max: 35 ns
  • SVHC: No SVHC (19-Dec-2011)

RoHS: Yes

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