Datasheet ES3F - Multicomp DIODE, ULTRA-FAST, 3 A, 300 V

Multicomp ES3F

Part Number: ES3F

Detailed Description

Manufacturer: Multicomp

Description: DIODE, ULTRA-FAST, 3 A, 300 V

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Docket:
ES3x Series
Features:
· · · · · · · · · · Glass passivated junction chip.

For surface mounted application. Low profile package. Built-in strain relief. Ideal for automated placement. Easy pick and place. Super fast recovery time for high efficiency. Glass passivated chip junction. High temperature soldering: 260°C/10 seconds at terminals. Plastic material.
SMC/DO-214AB
Dimensions : Inches (Millimetres)

Specifications:

  • Current Ifsm: 100 A
  • Diode Type: Fast Recovery
  • External Depth: 2.62 mm
  • External Length / Height: 6.22 mm
  • External Width: 7.11 mm
  • Forward Current If Max: 3 A
  • Forward Current If(AV): 3 A
  • Forward Surge Current Ifsm Max: 100 A
  • Forward Voltage VF Max: 1.3 V
  • Forward Voltage: 1.3 V
  • Junction Temperature Tj Max: 150°C
  • Junction Temperature Tj Min: -55°C
  • Junction to Case Thermal Resistance A: 47 °C/W
  • Mounting Type: SMD
  • Number of Pins: 2
  • Operating Temperature Range: -55°C to +150°C
  • Package / Case: SMC
  • Repetitive Reverse Voltage Vrrm Max: 300 V
  • Reverse Recovery Time trr Max: 35 ns
  • SVHC: No SVHC (19-Dec-2011)

RoHS: Yes

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