Our new medium-power transistors with solderable side pads

NXP

NXP Semiconductors releas medium-power general-purpose transistors with solderable sidepads in DFN2020D-3 (SOT1061D). The 23 new types with Vceo values of 20-80 V offer a collector current of 1-2 A on just a 2×2 mm small footprint. All types are AEC-Q101 qualified and come with an exposed heat sink for excellent thermal and electrical performance. Suitable for automatic optical inspection (AOI).

NXP DFN2020D-3

In comparison to the SOT89, our new transitors have 80% board space reduction. A low package height of only 0.62 mm makes the new product ideally suitable for space-constrained power management applications.

The new types complete the medium-power general-purpose transistor portfolio that now include more than 100 types in packages DFN2020, SOT89 and SOT223.

Key features and benefits

  • High collector current capability IC (up to 2 A) and ICM (up to 3 A)
  • VCEO ranging from 20 V to 80 V
  • Ideally suited for space-constrained medium-power applications
  • High-power dissipation capability
  • Exposed heat sink for excellent thermal and electrical performance
  • High energy efficiency due to less heat generation
  • Leadless, very small SMD plastic package with medium-power capability
  • 100% solderable sidepads, suitable for automatic optical inspection (AOI)
  • AEC-Q101 qualified

Key applications

  • Linear voltage regulators
  • Battery-driven devices
  • MOSFET drivers
  • Low-side switches
  • Power management
  • Amplifiers

Related Links

  • General purpose medium power transistors landing page
  • Medium-power general-purpose transistors leaflet 
  • Package information page DFN2020D-3 (SOT1061D)
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