Micron Demonstrates Industry's First 4GB DDR Registered DIMM

Micron

Micron leads the industry in next generation memory technology development and implementation

Micron Technology has delivered the industry's first 4 Gigabyte (GB) Double Data Rate (DDR) synchronous DRAM (SDRAM) registered dual in-line memory module (DIMM) to Intel Corporation. The industry standard 4GB 184-pin PC1600 and PC2100 DDR SDRAM DIMM is enabled by Micron's recently announced 0.11mm 1Gb DDR266 SDRAM packaged in JEDEC-standard 400 mil TSOP packaging.

"Micron's demonstration of a 4GB Registered DIMM and the underlying 1Gb DDR SDRAM technology is an important step in enabling Intel platform customers with the latest high-density solutions," said Pete MacWilliams, Intel Senior Fellow.

"We are taking advantage of Micron's leading position in 1Gb DDR SDRAM development to be the first to demonstrate this high-density registered DDR SDRAM DIMM," said Bob Donnelly, Vice President of Micron's Computing and Consumer Group. "4GB registered DIMM modules are the highest-density modules available today and provide server and workstation customers with the ability to ship systems with up to 64GB of DDR SDRAM memory."

Micron is manufacturing the 1Gb DDR SDRAM on 0.11mm process technology using stacked capacitors, the most advanced process technology in the industry. "Manufacturing these components on Micron's 0.11mm process technology makes them highly competitive in terms of cost and performance," said Terry Lee, Executive Director of Advanced Technology and Strategic Marketing for Micron's Computing and Consumer Group. "The use of this advanced process technology delivers a smaller die size, which has enabled us to develop high density DIMM modules. We are also applying 0.11mm process technology to other high-volume products, continuing our long-standing tradition of cost reduction and efficiency."

Micron Technology, Inc., is one of the world's leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets DRAMs, Flash memory, CMOS image sensors, other semiconductor components and memory modules for use in leading-edge computing, consumer, networking, and mobile products.

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