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Datasheet Texas Instruments MSP430G2433IPW20R

Datasheet Texas Instruments MSP430G2433IPW20R

ManufacturerTexas Instruments
SeriesMSP430G2433
Part NumberMSP430G2433IPW20R

MSP430G2x33, MSP430G2x03 Mixed Signal Microcontroller 20-TSSOP -40 to 85

Datasheets

  • Download » Datasheet, PDF, 1.8 Mb, Revision: G, 04-27-2016
    MSP430G2x33, MSP430G2x03 Mixed-Signal Microcontrollers datasheet
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    Design MSP430G2533, MSP430G2433, MSP430G2333, MSP430G2233
    MSP430G2403, MSP430G2303, MSP430G2203
    SLAS734G – APRIL 2011 – REVISED APRIL 2016 MSP430G2x33, MSP430G2x03 Mixed-Signal Microcontrollers
    1 Device Overview
    1.1 Features 1 Low Supply-Voltage Range: 1.8 V to 3.6 V Ultra-Low Power Consumption
    – Active Mode: 230 µA at 1 MHz, 2.2 V
    – Standby Mode: 0.5 µA
    – Off Mode (RAM Retention): 0.1 µA Five Power-Saving Modes Ultra-Fast Wake up From Standby Mode in Less
    Than 1 µs 16-Bit RISC Architecture, 62.5-ns Instruction Cycle
    Time Basic Clock Module Configurations
    – Internal Frequencies up to 16 MHz With Four
    Calibrated Frequencies
    – Internal Very-Low-Power Low-Frequency (LF)
    Oscillator
    – 32-kHz Crystal
    – External Digital Clock Source Two 16-Bit Timer_A With Three Capture/Compare
    Registers Up to 24 Capacitive-Touch Enabled I/O Pins 1.2 Applications Power Management ...

Prices

Family: MSP430G2203, MSP430G2233, MSP430G2303, MSP430G2333, MSP430G2403, MSP430G2433, MSP430G2533

Status

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

Packaging

Pin20
Package TypePW
Industry STD TermTSSOP
JEDEC CodeR-PDSO-G
Package QTY2000
CarrierLARGE T&R
Device Marking430G2433
Width (mm)4.4
Length (mm)6.5
Thickness (mm)1
Pitch (mm).65
Max Height (mm)1.2
Mechanical DataDownload »

Parametrics

ADCADC10 - 8ch
AESN/A
Active Power330 uA/MHz
Additional FeaturesWatchdog,Temp Sensor,Brown Out Reset,IrDA
BSLUART
CPUMSP430
Featuredg2
Frequency16 MHz
GPIO Pins24
I2C1
Max VCC3.6
Min VCC1.8
MultiplierN/A
Non-volatile Memory8 KB
Operating Temperature Range-40 to 85 C
Package GroupTSSOP
Package Size: mm2:W x L20TSSOP: 42 mm2: 6.4 x 6.5(TSSOP) PKG
RAM0.5 KB
RatingCatalog
SPI2
Special I/OCapacitive Touch I/O
Standby Power0.7 LPM3-uA
Timers - 16-bit2
UART1
Wakeup Time1.5 us

Eco Plan

RoHSCompliant

Design Kits & Evaluation Modules

  • Evaluation Modules & Boards: 430BOOST-CC110L
    CC110L RF BoosterPack
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: 430BOOST-SENSE1
    MSP430 Capacitive Touch BoosterPack
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: MSP-EXP430G2
    MSP430 LaunchPad Value Line Development kit
    Lifecycle Status: Active (Recommended for new designs)
  • Development Kits: MSP-FET430U28A
    28-pin Target Development Board and MSP-FET USB Programmer Bundle for MSP430F2x and MSP430G2x MCUs
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: ENERGYTRACE
    MSP EnergyTrace Technology
    Lifecycle Status: Active (Recommended for new designs)

Application Notes

  • Download » Application Notes, PDF, 1.1 Mb, 05-21-2013
    Capacitive Touch Sensing, MSP430 Button Gate Time Optimization and Tuning Guide
    MSP430™ microcontroller based capacitive touch buttons can offer increased performance when properly optimized and tuned for their specific application. Performance benefits that result from button optimization can include, but are not limited to, decreased power consumption, improved response time, and the ability to grow a design to include more buttons. This application report provides th
  • Download » Application Notes, PDF, 1.0 Mb, 05-21-2013
    Capacitive Touch Sensing, MSP430 Slider and Wheel Tuning Guide
    This application report provides guidelines on how to tune capacitive touch sliders and wheels running on the MSP430™ microcontrollers. It identifies the hardware and software parameters as well as explains the steps used in tuning sliders and wheels.The slider and wheel tuning is based on the APIs defined within the Capacitive Touch Sense Library (CAPSENSELIBRARY).
  • Download » Application Notes, PDF, 784 Kb, Revision: A, 11-17-2015
    Capacitive Touch Hardware Design Guide (Rev. A)
    Capacitive touch detection is sometimes considered more art than science. This often results in multiple design iterations before the optimum performance is achieved. There are, however, good design practices for circuit layout and principles of materials that need to be understood to keep the number of iterations to a minimum. This design guide describes a process for creating and designing capac
  • Download » Application Notes, PDF, 373 Kb, Revision: B, 08-14-2013
    1-uA Capacitive Grip Detection Based on MSP430 Microcontrollers (Rev. B)
    This application report discusses how to design a simple and ultra low-power grip detector BoosterPack for the MSP430 LaunchPad™. The PINOSC feature in every msp430G2xx2 and msp430G2xx3 device makes it possible to eliminate all the external components when implementing a capacitive touch design. All the components used in the grip detector, such as capacitive sensors, LEDs are all integrate
  • Download » Application Notes, PDF, 237 Kb, Revision: E, 05-04-2018
    Migrating From MSP430 F2xx and G2xx Families to MSP430 FR4xx and FR2xx Family (Rev. E)
    This application report helps to ease the migration from MSP430F2xx flash-based MCUs to the MSP430FR4xx and MSP430FR2xx family of FRAM-based MCUs. It discusses programming system hardware core architecture and peripheral considerations. The intent is to highlight key differences between the two families. For more information on the use of the MSP430FR4xx and MSP430FR2xx devices see the MSP430
  • Download » Application Notes, PDF, 179 Kb, Revision: E, 11-03-2016
    Migrating from the MSP430F2xx,G2xx Family to the MSP430FR58xx/FR59xx/68xx/69xx (Rev. E)
    This application report enables easy migration from MSP430F2xx flash-based MCUs to the MSP430FR58xx/FR59xx/68xx/69xx family of FRAM-based MCUs. For the migration guide to MSP430FR57xx, see Migrating From the MSP430F2xx Family to the MSP430FR57xx Family. It covers programming, system, and peripheral considerations when migrating firmware. The intent is to highlight key differences between the two f

Moldel Line

Series: MSP430G2433 (7)

Manufacturer's Classification

  • Semiconductors > Microcontrollers (MCU) > MSP430 ultra-low-power MCUs > MSP430G2x/i2x
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