Datasheet Texas Instruments AM26LV32

Manufacturer	Texas Instruments
Series	AM26LV32

Low-Voltage High-Speed Quadruple Differential Line Receiver

Datasheets

PDF, 1.0 Mb, Revision: F, File published: Nov 18, 2016

Extract from the document

	AM26LV32CD	AM26LV32CDE4	AM26LV32CDG4	AM26LV32CDR	AM26LV32CDRE4	AM26LV32CDRG4	AM26LV32CNSLE	AM26LV32CNSR	AM26LV32CNSRG4	AM26LV32ID	AM26LV32IDE4	AM26LV32IDG4	AM26LV32IDR	AM26LV32INS	AM26LV32INSG4	AM26LV32INSR	AM26LV32INSRG4
Lifecycle Status	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)	Obsolete (Manufacturer has discontinued the production of the device)	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)
Manufacture's Sample Availability	Yes	No	No	No	No	No	No	No	No	Yes	No	No	No	Yes	Yes	Yes	Yes

	AM26LV32CD	AM26LV32CDE4	AM26LV32CDG4	AM26LV32CDR	AM26LV32CDRE4	AM26LV32CDRG4	AM26LV32CNSLE	AM26LV32CNSR	AM26LV32CNSRG4	AM26LV32ID	AM26LV32IDE4	AM26LV32IDG4	AM26LV32IDR	AM26LV32INS	AM26LV32INSG4	AM26LV32INSR	AM26LV32INSRG4
N	1	2	3	4	5	6	7	8	9	10	11	12	13	14	15	16	17
Pin	16	16	16	16	16	16	16	16	16	16	16	16	16	16	16	16	16
Package Type	D	D	D	D	D	D	NS	NS	NS	D	D	D	D	NS	NS	NS	NS
Industry STD Term	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC	SOP	SOP	SOP	SOIC	SOIC	SOIC	SOIC	SOP	SOP	SOP	SOP
JEDEC Code	R-PDSO-G	R-PDSO-G	R-PDSO-G	R-PDSO-G	R-PDSO-G	R-PDSO-G	R-PDSO-G	R-PDSO-G	R-PDSO-G	R-PDSO-G	R-PDSO-G	R-PDSO-G	R-PDSO-G	R-PDSO-G	R-PDSO-G	R-PDSO-G	R-PDSO-G
Package QTY	40	40	40	2500	2500	2500		2000	2000	40	40	40	2500	50	50	2000	2000
Carrier	TUBE	TUBE	TUBE	LARGE T&R	LARGE T&R	LARGE T&R		LARGE T&R	LARGE T&R	TUBE	TUBE	TUBE	LARGE T&R	TUBE	TUBE	LARGE T&R	LARGE T&R
Device Marking	AM26LV32C	AM26LV32C	AM26LV32C	AM26LV32C	AM26LV32C	AM26LV32C		26LV32	26LV32	AM26LV32I	AM26LV32I	AM26LV32I	AM26LV32I	26LV32I	26LV32I	26LV32I	26LV32I
Width (mm)	3.91	3.91	3.91	3.91	3.91	3.91	5.3	5.3	5.3	3.91	3.91	3.91	3.91	5.3	5.3	5.3	5.3
Length (mm)	9.9	9.9	9.9	9.9	9.9	9.9	10.3	10.3	10.3	9.9	9.9	9.9	9.9	10.3	10.3	10.3	10.3
Thickness (mm)	1.58	1.58	1.58	1.58	1.58	1.58	1.95	1.95	1.95	1.58	1.58	1.58	1.58	1.95	1.95	1.95	1.95
Pitch (mm)	1.27	1.27	1.27	1.27	1.27	1.27	1.27	1.27	1.27	1.27	1.27	1.27	1.27	1.27	1.27	1.27	1.27
Max Height (mm)	1.75	1.75	1.75	1.75	1.75	1.75	2	2	2	1.75	1.75	1.75	1.75	2	2	2	2
Mechanical Data	Download	Download	Download	Download	Download	Download	Download	Download	Download	Download	Download	Download	Download	Download	Download	Download	Download

Parameters / Models	AM26LV32CD	AM26LV32CDE4	AM26LV32CDG4	AM26LV32CDR	AM26LV32CDRE4	AM26LV32CDRG4	AM26LV32CNSLE	AM26LV32CNSR	AM26LV32CNSRG4	AM26LV32ID	AM26LV32IDE4	AM26LV32IDG4	AM26LV32IDR	AM26LV32INS	AM26LV32INSG4	AM26LV32INSR	AM26LV32INSRG4
# of TX/RX							0 TX / 4 RX
Approx. Price (US$)							0.47 \| 1ku
ESD(kV)							2
Footprint							AM26LS32
ICC(Max), mA	17	17	17	17	17	17		17	17	17	17	17	17	17	17	17	17
ICC(Max)(mA)							17
Operating Temperature Range, C	-40 to 85,0 to 70	-40 to 85,0 to 70	-40 to 85,0 to 70	-40 to 85,0 to 70	-40 to 85,0 to 70	-40 to 85,0 to 70		-40 to 85,0 to 70	-40 to 85,0 to 70	-40 to 85,0 to 70	-40 to 85,0 to 70	-40 to 85,0 to 70	-40 to 85,0 to 70	-40 to 85,0 to 70	-40 to 85,0 to 70	-40 to 85,0 to 70	-40 to 85,0 to 70
Operating Temperature Range(C)							-40 to 85 0 to 70
Package Group	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC	SO	SO	SO	SOIC	SOIC	SOIC	SOIC	SO	SO	SO	SO
Package Size: mm2:W x L (PKG)							16SOIC: 59 mm2: 6 x 9.9(SOIC)
Rating	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog
Receiver tpd(ns)							16
Receivers Per Package							4
Signaling Rate, Mbps	32	32	32	32	32	32		32	32	32	32	32	32	32	32	32	32
Signaling Rate(Mbps)							32
Supply Voltage(s), V	3.3	3.3	3.3	3.3	3.3	3.3		3.3	3.3	3.3	3.3	3.3	3.3	3.3	3.3	3.3	3.3
Supply Voltage(s)(V)							3.3

	AM26LV32CD	AM26LV32CDE4	AM26LV32CDG4	AM26LV32CDR	AM26LV32CDRE4	AM26LV32CDRG4	AM26LV32CNSLE	AM26LV32CNSR	AM26LV32CNSRG4	AM26LV32ID	AM26LV32IDE4	AM26LV32IDG4	AM26LV32IDR	AM26LV32INS	AM26LV32INSG4	AM26LV32INSR	AM26LV32INSRG4
RoHS	Compliant	Compliant	Compliant	Compliant	Compliant	Compliant	Not Compliant	Compliant	Compliant	Compliant	Compliant	Compliant	Compliant	Compliant	Compliant	Compliant	Compliant
Pb Free	No

Download
Wave Solder Exposure of SMT Packages
PDF, 206 Kb, File published: Sep 9, 2008
It is common practice to attach surface mount components to the underside of a printed circuit board (PCB) by processing the PCB through a wave soldering operation after gluing the components to the PCB. This paper ummarizes results of several tests performed to understand the performance of surface mount components when exposed to the conditions outlined in JESD22A111.

Series: AM26LV32 (17)