Datasheet Texas Instruments MSP430F6458

ManufacturerTexas Instruments
SeriesMSP430F6458
Datasheet Texas Instruments MSP430F6458

MSP430F64xx Mixed Signal Microcontroller

Datasheets

MSP430F665x, MSP430F645x, MSP430F565x, MSP430F535x Mixed Signal Microcontroller datasheet
PDF, 1.9 Mb, Revision: C, File published: Oct 21, 2013
Extract from the document

Prices

Status

MSP430F6458IPZMSP430F6458IPZRMSP430F6458IZQWR
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNo

Packaging

MSP430F6458IPZMSP430F6458IPZRMSP430F6458IZQWR
N123
Pin100100113
Package TypePZPZZQW
Industry STD TermLQFPLQFPBGA MICROSTAR JUNIOR
JEDEC CodeS-PQFP-GS-PQFP-GS-PBGA-N
Package QTY9010002500
CarrierJEDEC TRAY (10+1)LARGE T&RLARGE T&R
Device MarkingF6458F6458F6458
Width (mm)14147
Length (mm)14147
Thickness (mm)1.41.4.74
Pitch (mm).5.5.5
Max Height (mm)1.61.61
Mechanical DataDownloadDownloadDownload

Parametrics

Parameters / ModelsMSP430F6458IPZ
MSP430F6458IPZ
MSP430F6458IPZR
MSP430F6458IPZR
MSP430F6458IZQWR
MSP430F6458IZQWR
ADCADC12 - 12chADC12 - 12chADC12 - 12ch
AESN/AN/AN/A
Active Power, uA/MHz370370370
Additional FeaturesLCD,Real-Time Clock,Watchdog,DAC,Temp Sensor,Brown Out Reset,IrDALCD,Real-Time Clock,Watchdog,DAC,Temp Sensor,Brown Out Reset,IrDALCD,Real-Time Clock,Watchdog,DAC,Temp Sensor,Brown Out Reset,IrDA
BSLUARTUARTUART
CPUMSP430MSP430MSP430
Comparators121212
DMA666
Featuredf6f6f6
Frequency, MHz202020
GPIO Pins747474
I2C333
Max VCC3.63.63.6
Min VCC1.81.81.8
Multiplier32x3232x3232x32
Non-volatile Memory, KB384384384
Operating Temperature Range, C-40 to 85-40 to 85-40 to 85
Package GroupLQFPLQFPBGA MICROSTAR JUNIOR
Package Size: mm2:W x L, PKG100LQFP: 256 mm2: 16 x 16(LQFP)100LQFP: 256 mm2: 16 x 16(LQFP)113BGA MICROSTAR JUNIOR: 49 mm2: 7 x 7(BGA MICROSTAR JUNIOR)
RAM, KB343434
RatingCatalogCatalogCatalog
SPI666
Special I/ON/AN/AN/A
Standby Power, LPM3-uA2.62.62.6
Timers - 16-bit444
UART333
Wakeup Time, us333

Eco Plan

MSP430F6458IPZMSP430F6458IPZRMSP430F6458IZQWR
RoHSCompliantCompliantCompliant

Application Notes

  • Using the MSP430 RTC_B Module With Battery Backup Supply (Rev. B)
    PDF, 135 Kb, Revision: B, File published: Jun 4, 2015
    Some applications need to retain an accurate real-time clock (RTC) through battery changes, power outages, and other events. For these applications, MSP430в„ў devices that contain the RTC_B Real-Time Clock module with a Battery Backup System can be a great fit. This application note demonstrates how to use RTC_B with Battery Backup Supply functionality to retain the time and keep the RTC counting th
  • MSP430 Embedded Application Binary Interface
    PDF, 596 Kb, File published: May 16, 2012
    This document is a specification for the ELF-based Embedded Application Binary Interface (EABI) for the MSP430 family of processors from Texas Instruments. The EABI defines the low-level interface between programs, program components, and the execution environment, including the operating system if one is present. Components of the EABI include calling conventions, data layout and addressing conve
  • Designing With MSP430 and Segment LCDs (Rev. A)
    PDF, 2.1 Mb, Revision: A, File published: Jul 20, 2015
    Segment liquid crystal displays (LCDs) are needed to provide information to users in a wide variety of applications from smart meters to electronic shelf labels (ESL) to medical equipment. Several MSP430в„ў microcontroller families include built-in low-power LCD driver circuitry that allows the MSP430 MCU to directly control the segmented LCD glass. This application note helps explain how segmented
  • General Oversampling of MSP ADCs for Higher Resolution (Rev. A)
    PDF, 551 Kb, Revision: A, File published: Apr 1, 2016
    Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl
  • MSP Code Protection Features
    PDF, 752 Kb, File published: Dec 7, 2015
    MSP microcontrollers (MCUs) offer a number of features to help control code accessibility in the device, to add different layers of code access management and protection strategies. These include features that can lock or password protect the JTAG/SBW access, IP Encapsulation (IPE) to isolate sensitive code with different permissions than the rest of the program, and bootloader (BSL) access featur
  • ESD Diode Current Specification
    PDF, 520 Kb, File published: Dec 7, 2015
    This document explains the maximum ESD diode current specified for GPIO on MSP microcontrollers. Sometimes signals on specific pins exceed the supply of the MSP MCU. In such a case, the device can handle this overvoltage condition through the ESD diodes, but the ESD diode specification must be considered during application design. The items to be considered are described in this document.

Model Line

Manufacturer's Classification

  • Semiconductors> Microcontrollers (MCU)> MSP430 ultra-low-power MCUs> MSP430F5x/6x
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