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Datasheet Texas Instruments MSP430FR5724

Datasheet Texas Instruments MSP430FR5724

ManufacturerTexas Instruments
SeriesMSP430FR5724

MSP430FR5724 8 MHz ULP microcontroller with 8 KB FRAM, 1 KB SRAM, 21 IO, 10-bit ADC and comparator

Datasheets

  • Download » Datasheet PDF, 2.2 Mb, Revision: B, File published: Apr 25, 2016
    MSP430FR572x Mixed-Signal Microcontrollers datasheet
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    Product
    Folder Order
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    Documents Tools &
    Software Support &
    Community MSP430FR5729, MSP430FR5728, MSP430FR5727, MSP430FR5726, MSP430FR5725
    MSP430FR5724, MSP430FR5723, MSP430FR5722, MSP430FR5721, MSP430FR5720
    SLASE35C – MAY 2014 – REVISED DECEMBER 2017 MSP430FR572x Mixed-Signal Microcontrollers
    1 Device Overview
    1.1 Features 1 Embedded Microcontroller
    – 16-Bit RISC Architecture up to 8-MHz Clock
    – Wide Supply Voltage Range (2 V to 3.6 V)
    – –40°C to 85°C Operation Optimized Ultra-Low-Power Modes
    – Active Mode: 81.4 µA/MHz (Typical)
    – Standby (LPM3 With VLO): 6.3 µA (Typical)
    – Real-Time Clock (RTC) (LPM3.5 With Crystal):
    1.5 ВµA (Typical)
    – Shutdown (LPM4.5): 0.32 µA (Typical) Ultra-Low-Power Ferroelectric RAM (FRAM)
    – Up to 16KB of Nonvolatile Memory
    – Ultra-Low-Power Writes
    – Fast Write at 125 ns per Word (16KB in 1 ms)
    – Built-In Error Correction Coding (ECC) and
    Memory Protection Unit (MPU) ...

Prices

Family: MSP430FR5720, MSP430FR5721, MSP430FR5722, MSP430FR5723, MSP430FR5724, MSP430FR5725, MSP430FR5726, MSP430FR5727, MSP430FR5728, MSP430FR5729

Status

MSP430FR5724IPWMSP430FR5724IPWRMSP430FR5724IRGERMSP430FR5724IRGET
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNoYes

Packaging

MSP430FR5724IPWMSP430FR5724IPWRMSP430FR5724IRGERMSP430FR5724IRGET
Pin28282424
Package TypePWPWRGERGE
Industry STD TermTSSOPTSSOPVQFNVQFN
JEDEC CodeR-PDSO-GR-PDSO-GS-PQFP-NS-PQFP-N
Package QTY5020003000250
CarrierTUBELARGE T&RLARGE T&RSMALL T&R
Device Marking430FR5724430FR572457245724
Width (mm)4.44.444
Length (mm)9.79.744
Thickness (mm)11.88.88
Pitch (mm).65.65.5.5
Max Height (mm)1.21.211
Mechanical DataDownload »Download »Download »Download »

Parametrics

MSP430FR5724IPWMSP430FR5724IPWRMSP430FR5724IRGERMSP430FR5724IRGET
MSP430FR5724IPWMSP430FR5724IPWRMSP430FR5724IRGERMSP430FR5724IRGET
ADCADC10 - 8chADC10 - 8chADC10 - 8chADC10 - 8ch
AESN/AN/AN/AN/A
Active Power, uA/MHz125125125125
Additional FeaturesReal-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDAReal-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDAReal-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDAReal-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDA
BSLUARTUARTUARTUART
CPUMSP430MSP430MSP430MSP430
Comparators12121212
DMA3333
Featuredfr5fr5fr5fr5
Frequency, MHz8888
GPIO Pins21212121
I2C1111
Max VCC3.63.63.63.6
Min VCC2222
Multiplier32x3232x3232x3232x32
Non-volatile Memory, KB8888
Operating Temperature Range, C-40 to 85-40 to 85-40 to 85-40 to 85
Package GroupTSSOPTSSOPVQFNVQFN
Package Size: mm2:W x L, PKG28TSSOP: 62 mm2: 6.4 x 9.7(TSSOP)28TSSOP: 62 mm2: 6.4 x 9.7(TSSOP)24VQFN: 16 mm2: 4 x 4(VQFN)24VQFN: 16 mm2: 4 x 4(VQFN)
RAM, KB1111
RatingCatalogCatalogCatalogCatalog
SPI2222
Security EnablerCryptographic acceleration,Debug security,Physical security,Secure FW and SW update,Software IP protectionCryptographic acceleration,Debug security,Physical security,Secure FW and SW update,Software IP protectionCryptographic acceleration,Debug security,Physical security,Secure FW and SW update,Software IP protectionCryptographic acceleration,Debug security,Physical security,Secure FW and SW update,Software IP protection
Special I/ON/AN/AN/AN/A
Standby Power, LPM3-uA6.46.46.46.4
Timers - 16-bit3333
UART1111
Wakeup Time, us78787878

Eco Plan

Application Notes

  • Download » Application Notes PDF, 3.5 Mb, Revision: A, File published: Mar 2, 2015
    Over-the-Air (OTA) Update With the MSP430FR57xx (Rev. A)
  • Download » Application Notes PDF, 1.5 Mb, File published: Mar 29, 2012
    MSP430 System-Level ESD Considerations
    System-Level ESD has become increasingly demanding with silicon technology scaling towards lower voltages and the need for designing cost-effective and ultra-low power components. This application report addresses three different ESD topics to help board designers and OEMs understand and design robust system-level designs:(1) Component-level ESD testing and system-level ESD testing, their differ
  • Download » Application Notes PDF, 103 Kb, Revision: B, File published: Feb 4, 2015
    Maximizing Write Speed on the MSP430в„ў FRAM (Rev. B)
    Nonvolatile low-power ferroelectric RAM (FRAM) is capable of extremely high-speed write accesses. This application report discusses how to maximize FRAM write speeds specifically in the MSP430FRxx family using simple techniques. The document uses examples from bench tests performed on the MSP430FR5739 device, which can be extended to all MSP430в„ў FRAM-based devices, and discusses tradeoffs such as
  • Download » Application Notes PDF, 326 Kb, File published: Jun 23, 2014
    MSP430 FRAM Technology – How To and Best Practices
    FRAM is a non-volatile memory technology that behaves similar to SRAM while enabling a whole host of new applications, but also changing the way firmware should be designed. This application report outlines the how to and best practices of using FRAM technology in MSP430 from an embedded software development perspective. It discusses how to implement a memory layout according to application-specif
  • Download » Application Notes PDF, 295 Kb, Revision: A, File published: May 1, 2014
    MSP430 FRAM Quality and Reliability (Rev. A)
    FRAM is a nonvolatile embedded memory technology and is known for its ability to be ultra-low power while being the most flexible and easy-to-use universal memory solution available today. This application report is intended to give new FRAM users and those migrating from flash-based applications knowledge on how FRAM meets key quality and reliability requirements such as data retention and endura
  • Download » Application Notes PDF, 41 Kb, Revision: A, File published: Sep 13, 2012
    Migrating from the USCI Module to the eUSCI Module (Rev. A)
    The purpose of this application report is to enable easy migration for designs based on the USCI_A and USCI_B modules to the eUSCI_A and the eUSCI_B modules. The document highlights the new features in the eUSCI module and the main differences between the USCI and the eUSCI modules.
  • Download » Application Notes PDF, 154 Kb, Revision: A, File published: Feb 16, 2012
    Migrating from the MSP430F2xx Family to the MSP430FR57xx Family (Rev. A)
    This application report enables easy migration from MSP430F2xx Flash-based MCUs to the MSP430FR57xx family FRAM-based MCU. It covers programming, system, and peripheral considerations when migrating firmware. The purpose is to highlight differences between the two families. For more information on the usage of the MSP430FR57xx features, see the MSP430FR57xx Family User's Guide (
  • Download » Application Notes PDF, 551 Kb, Revision: A, File published: Apr 1, 2016
    General Oversampling of MSP ADCs for Higher Resolution (Rev. A)
    Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl

Moldel Line

Series: MSP430FR5724 (4)

Manufacturer's Classification

  • Semiconductors> Microcontrollers (MCU)> MSP430 ultra-low-power MCUs> MSP430FRxx FRAM

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