Datasheet Texas Instruments MSP430FR5738

ManufacturerTexas Instruments
SeriesMSP430FR5738
Datasheet Texas Instruments MSP430FR5738

MSP430FR5738 24 MHz ULP microcontroller with 16 KB FRAM, 1 KB SRAM, 21 IO, 10-bit ADC and comparator

Datasheets

MSP430FR573x Mixed-Signal Microcontrollers datasheet
PDF, 2.3 Mb, Revision: K, File published: Apr 25, 2016
Extract from the document

Prices

Status

MSP430FR5738IPWMSP430FR5738IPWRMSP430FR5738IRGERMSP430FR5738IRGETMSP430FR5738IYQDRMSP430FR5738IYQDT
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoYesYesNoYesYes

Packaging

MSP430FR5738IPWMSP430FR5738IPWRMSP430FR5738IRGERMSP430FR5738IRGETMSP430FR5738IYQDRMSP430FR5738IYQDT
N123456
Pin282824242424
Package TypePWPWRGERGEYQDYQD
Industry STD TermTSSOPTSSOPVQFNVQFNDSBGADSBGA
JEDEC CodeR-PDSO-GR-PDSO-GS-PQFP-NS-PQFP-NS-XBGA-NS-XBGA-N
Package QTY50200030002503000250
CarrierTUBELARGE T&RLARGE T&RSMALL T&RLARGE T&RSMALL T&R
Device Marking430FR5738430FR57385738430FR430FR5738430FR5738
Width (mm)4.44.44422
Length (mm)9.79.74422
Thickness (mm)11.88.88.4.4
Pitch (mm).65.65.5.5.4.4
Max Height (mm)1.21.211.625.625
Mechanical DataDownloadDownloadDownloadDownloadDownloadDownload

Parametrics

Parameters / ModelsMSP430FR5738IPW
MSP430FR5738IPW
MSP430FR5738IPWR
MSP430FR5738IPWR
MSP430FR5738IRGER
MSP430FR5738IRGER
MSP430FR5738IRGET
MSP430FR5738IRGET
MSP430FR5738IYQDR
MSP430FR5738IYQDR
MSP430FR5738IYQDT
MSP430FR5738IYQDT
ADCADC10 - 8chADC10 - 8chADC10 - 8chADC10 - 8chADC10 - 8chADC10 - 8ch
AESN/AN/AN/AN/AN/AN/A
Active Power, uA/MHz91.66791.66791.66791.66791.66791.667
Additional FeaturesReal-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDAReal-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDAReal-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDAReal-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDAReal-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDAReal-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDA
BSLUARTUARTUARTUARTUARTUART
CPUMSP430MSP430MSP430MSP430MSP430MSP430
Comparators121212121212
DMA333333
Featuredfr5fr5fr5fr5fr5fr5
Frequency, MHz242424242424
GPIO Pins212121212121
I2C111111
Max VCC3.63.63.63.63.63.6
Min VCC222222
Multiplier32x3232x3232x3232x3232x3232x32
Non-volatile Memory, KB161616161616
Operating Temperature Range, C-40 to 85-40 to 85-40 to 85-40 to 85-40 to 85-40 to 85
Package GroupTSSOPTSSOPVQFNVQFNDSBGADSBGA
Package Size: mm2:W x L, PKG28TSSOP: 62 mm2: 6.4 x 9.7(TSSOP)28TSSOP: 62 mm2: 6.4 x 9.7(TSSOP)24VQFN: 16 mm2: 4 x 4(VQFN)24VQFN: 16 mm2: 4 x 4(VQFN)See datasheet (DSBGA)See datasheet (DSBGA)
RAM, KB111111
RatingCatalogCatalogCatalogCatalogCatalogCatalog
SPI222222
Security EnablerCryptographic acceleration,Debug security,Physical security,Secure FW and SW update,Software IP protectionCryptographic acceleration,Debug security,Physical security,Secure FW and SW update,Software IP protectionCryptographic acceleration,Debug security,Physical security,Secure FW and SW update,Software IP protectionCryptographic acceleration,Debug security,Physical security,Secure FW and SW update,Software IP protectionCryptographic acceleration,Debug security,Physical security,Secure FW and SW update,Software IP protectionCryptographic acceleration,Debug security,Physical security,Secure FW and SW update,Software IP protection
Special I/ON/AN/AN/AN/AN/AN/A
Standby Power, LPM3-uA6.46.46.46.46.46.4
Timers - 16-bit333333
UART111111
Wakeup Time, us787878787878

Eco Plan

MSP430FR5738IPWMSP430FR5738IPWRMSP430FR5738IRGERMSP430FR5738IRGETMSP430FR5738IYQDRMSP430FR5738IYQDT
RoHSCompliantCompliantCompliantCompliantCompliantCompliant

Application Notes

  • MSP430 Firmware Updates over I2C using Linux
    PDF, 1.8 Mb, File published: Dec 7, 2015
  • Software I2C on MSP430 MCUs
    PDF, 126 Kb, File published: May 18, 2016
    Hardware and layout limitations often require smaller package sizes that could potentially create a tradeoff for the number of serial peripherals available to the user. With the I2C protocol, special software can be created to use a pair of simple GPIO ports to emulate an I2C master device. This allows programmers to be flexible with pin assignments and enables smaller package devices to overcome
  • Over-the-Air (OTA) Update With the MSP430FR57xx (Rev. A)
    PDF, 3.5 Mb, Revision: A, File published: Mar 2, 2015
  • MSP430 System-Level ESD Considerations
    PDF, 1.5 Mb, File published: Mar 29, 2012
    System-Level ESD has become increasingly demanding with silicon technology scaling towards lower voltages and the need for designing cost-effective and ultra-low power components. This application report addresses three different ESD topics to help board designers and OEMs understand and design robust system-level designs:(1) Component-level ESD testing and system-level ESD testing, their differ
  • Maximizing Write Speed on the MSP430в„ў FRAM (Rev. B)
    PDF, 103 Kb, Revision: B, File published: Feb 4, 2015
    Nonvolatile low-power ferroelectric RAM (FRAM) is capable of extremely high-speed write accesses. This application report discusses how to maximize FRAM write speeds specifically in the MSP430FRxx family using simple techniques. The document uses examples from bench tests performed on the MSP430FR5739 device, which can be extended to all MSP430в„ў FRAM-based devices, and discusses tradeoffs such as
  • MSP430 FRAM Technology – How To and Best Practices
    PDF, 326 Kb, File published: Jun 23, 2014
    FRAM is a non-volatile memory technology that behaves similar to SRAM while enabling a whole host of new applications, but also changing the way firmware should be designed. This application report outlines the how to and best practices of using FRAM technology in MSP430 from an embedded software development perspective. It discusses how to implement a memory layout according to application-specif
  • MSP430 FRAM Quality and Reliability (Rev. A)
    PDF, 295 Kb, Revision: A, File published: May 1, 2014
    FRAM is a nonvolatile embedded memory technology and is known for its ability to be ultra-low power while being the most flexible and easy-to-use universal memory solution available today. This application report is intended to give new FRAM users and those migrating from flash-based applications knowledge on how FRAM meets key quality and reliability requirements such as data retention and endura
  • Migrating from the USCI Module to the eUSCI Module (Rev. A)
    PDF, 41 Kb, Revision: A, File published: Sep 13, 2012
    The purpose of this application report is to enable easy migration for designs based on the USCI_A and USCI_B modules to the eUSCI_A and the eUSCI_B modules. The document highlights the new features in the eUSCI module and the main differences between the USCI and the eUSCI modules.
  • Migrating from the MSP430F2xx Family to the MSP430FR57xx Family (Rev. A)
    PDF, 154 Kb, Revision: A, File published: Feb 16, 2012
    This application report enables easy migration from MSP430F2xx Flash-based MCUs to the MSP430FR57xx family FRAM-based MCU. It covers programming, system, and peripheral considerations when migrating firmware. The purpose is to highlight differences between the two families. For more information on the usage of the MSP430FR57xx features, see the MSP430FR57xx Family User's Guide (
  • General Oversampling of MSP ADCs for Higher Resolution (Rev. A)
    PDF, 551 Kb, Revision: A, File published: Apr 1, 2016
    Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl

Model Line

Manufacturer's Classification

  • Semiconductors> Microcontrollers (MCU)> MSP430 ultra-low-power MCUs> MSP430FRxx FRAM
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