Datasheet Texas Instruments MSP430FR5739

ManufacturerTexas Instruments
SeriesMSP430FR5739
Datasheet Texas Instruments MSP430FR5739

MSP430FR5739 24 MHz ULP microcontroller with 16 KB FRAM, 1 KB SRAM, 32 IO, 10-bit ADC & comparator

Datasheets

MSP430FR573x Mixed-Signal Microcontrollers datasheet
PDF, 2.3 Mb, Revision: K, File published: Apr 25, 2016
Extract from the document

Prices

Status

MSP430FR5739IDAMSP430FR5739IDARMSP430FR5739IRHARMSP430FR5739IRHAT
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoYesYesNo

Packaging

MSP430FR5739IDAMSP430FR5739IDARMSP430FR5739IRHARMSP430FR5739IRHAT
N1234
Pin38384040
Package TypeDADARHARHA
Industry STD TermTSSOPTSSOPVQFNVQFN
JEDEC CodeR-PDSO-GR-PDSO-GS-PQFP-NS-PQFP-N
Package QTY4020002500250
CarrierTUBELARGE T&RLARGE T&RSMALL T&R
Device MarkingM430FR5739M430FR5739FR5739M430
Width (mm)6.26.266
Length (mm)12.512.566
Thickness (mm)1.151.15.9.9
Pitch (mm).65.65.5.5
Max Height (mm)1.21.211
Mechanical DataDownloadDownloadDownloadDownload

Parametrics

Parameters / ModelsMSP430FR5739IDA
MSP430FR5739IDA
MSP430FR5739IDAR
MSP430FR5739IDAR
MSP430FR5739IRHAR
MSP430FR5739IRHAR
MSP430FR5739IRHAT
MSP430FR5739IRHAT
ADCADC10 - 12chADC10 - 12chADC10 - 12chADC10 - 12ch
AESN/AN/AN/AN/A
Active Power, uA/MHz91.66791.66791.66791.667
Additional FeaturesReal-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDAReal-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDAReal-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDAReal-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDA
BSLUARTUARTUARTUART
CPUMSP430MSP430MSP430MSP430
Comparators16161616
DMA3333
Featuredfr5fr5fr5fr5
Frequency, MHz24242424
GPIO Pins32323232
I2C1111
Max VCC3.63.63.63.6
Min VCC2222
Multiplier32x3232x3232x3232x32
Non-volatile Memory, KB16161616
Operating Temperature Range, C-40 to 85-40 to 85-40 to 85-40 to 85
Package GroupTSSOPTSSOPVQFNVQFN
Package Size: mm2:W x L, PKG38TSSOP: 101 mm2: 8.1 x 12.5(TSSOP)38TSSOP: 101 mm2: 8.1 x 12.5(TSSOP)40VQFN: 36 mm2: 6 x 6(VQFN)40VQFN: 36 mm2: 6 x 6(VQFN)
RAM, KB1111
RatingCatalogCatalogCatalogCatalog
SPI3333
Security EnablerCryptographic acceleration,Debug security,Physical security,Secure FW and SW update,Software IP protectionCryptographic acceleration,Debug security,Physical security,Secure FW and SW update,Software IP protectionCryptographic acceleration,Debug security,Physical security,Secure FW and SW update,Software IP protectionCryptographic acceleration,Debug security,Physical security,Secure FW and SW update,Software IP protection
Special I/ON/AN/AN/AN/A
Standby Power, LPM3-uA6.46.46.46.4
Timers - 16-bit5555
UART2222
Wakeup Time, us78787878

Eco Plan

MSP430FR5739IDAMSP430FR5739IDARMSP430FR5739IRHARMSP430FR5739IRHAT
RoHSCompliantCompliantCompliantCompliant

Application Notes

  • C Implementation of Cryptographic Algorithms (Rev. A)
    PDF, 588 Kb, Revision: A, File published: Jul 12, 2013
    This application report discusses the implementations of the AES, DES, TDES, and SHA-2 cryptographic algorithms written in the C programming language. These software cryptographic solutions were made for devices without hardware acceleration for these algorithms. This document does not go into common methods or practices using these algorithms; however, it does describe how to use the algorithms i
  • Over-the-Air (OTA) Update With the MSP430FR57xx (Rev. A)
    PDF, 3.5 Mb, Revision: A, File published: Mar 2, 2015
  • MSP430 System-Level ESD Considerations
    PDF, 1.5 Mb, File published: Mar 29, 2012
    System-Level ESD has become increasingly demanding with silicon technology scaling towards lower voltages and the need for designing cost-effective and ultra-low power components. This application report addresses three different ESD topics to help board designers and OEMs understand and design robust system-level designs:(1) Component-level ESD testing and system-level ESD testing, their differ
  • Maximizing Write Speed on the MSP430в„ў FRAM (Rev. B)
    PDF, 103 Kb, Revision: B, File published: Feb 4, 2015
    Nonvolatile low-power ferroelectric RAM (FRAM) is capable of extremely high-speed write accesses. This application report discusses how to maximize FRAM write speeds specifically in the MSP430FRxx family using simple techniques. The document uses examples from bench tests performed on the MSP430FR5739 device, which can be extended to all MSP430в„ў FRAM-based devices, and discusses tradeoffs such as
  • MSP430 FRAM Technology – How To and Best Practices
    PDF, 326 Kb, File published: Jun 23, 2014
    FRAM is a non-volatile memory technology that behaves similar to SRAM while enabling a whole host of new applications, but also changing the way firmware should be designed. This application report outlines the how to and best practices of using FRAM technology in MSP430 from an embedded software development perspective. It discusses how to implement a memory layout according to application-specif
  • MSP430 FRAM Quality and Reliability (Rev. A)
    PDF, 295 Kb, Revision: A, File published: May 1, 2014
    FRAM is a nonvolatile embedded memory technology and is known for its ability to be ultra-low power while being the most flexible and easy-to-use universal memory solution available today. This application report is intended to give new FRAM users and those migrating from flash-based applications knowledge on how FRAM meets key quality and reliability requirements such as data retention and endura
  • Migrating from the USCI Module to the eUSCI Module (Rev. A)
    PDF, 41 Kb, Revision: A, File published: Sep 13, 2012
    The purpose of this application report is to enable easy migration for designs based on the USCI_A and USCI_B modules to the eUSCI_A and the eUSCI_B modules. The document highlights the new features in the eUSCI module and the main differences between the USCI and the eUSCI modules.
  • Migrating from the MSP430F2xx Family to the MSP430FR57xx Family (Rev. A)
    PDF, 154 Kb, Revision: A, File published: Feb 16, 2012
    This application report enables easy migration from MSP430F2xx Flash-based MCUs to the MSP430FR57xx family FRAM-based MCU. It covers programming, system, and peripheral considerations when migrating firmware. The purpose is to highlight differences between the two families. For more information on the usage of the MSP430FR57xx features, see the MSP430FR57xx Family User's Guide (
  • General Oversampling of MSP ADCs for Higher Resolution (Rev. A)
    PDF, 551 Kb, Revision: A, File published: Apr 1, 2016
    Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl

Model Line

Manufacturer's Classification

  • Semiconductors> Microcontrollers (MCU)> MSP430 ultra-low-power MCUs> MSP430FRxx FRAM
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