Datasheet Texas Instruments SN54ALS02A

ManufacturerTexas Instruments
SeriesSN54ALS02A
Datasheet Texas Instruments SN54ALS02A

Quadruple 2-Input Positive-NOR Gates

Datasheets

Quadruple 2-Input Positive-NOR Gates datasheet
PDF, 1.1 Mb, Revision: B, File published: Dec 1, 1994
Extract from the document

Prices

Status

5962-86844012A5962-8684401DAJM38510/37301B2AJM38510/37301BCAM38510/37301B2AM38510/37301BCASN54ALS02AJSNJ54ALS02AFKSNJ54ALS02AJSNJ54ALS02AW
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNoNoNoNoNoNoNoNo

Packaging

5962-86844012A5962-8684401DAJM38510/37301B2AJM38510/37301BCAM38510/37301B2AM38510/37301BCASN54ALS02AJSNJ54ALS02AFKSNJ54ALS02AJSNJ54ALS02AW
N12345678910
Pin20142014201414201414
Package TypeFKWFKJFKJJFKJW
Industry STD TermLCCCCFPLCCCCDIPLCCCCDIPCDIPLCCCCDIPCFP
JEDEC CodeS-CQCC-NR-GDFP-FS-CQCC-NR-GDIP-TS-CQCC-NR-GDIP-TR-GDIP-TS-CQCC-NR-GDIP-TR-GDFP-F
Package QTY1111111111
CarrierTUBETUBETUBETUBETUBETUBETUBETUBETUBETUBE
Width (mm)8.895.978.896.678.896.676.678.896.675.97
Length (mm)8.899.218.8919.568.8919.5619.568.8919.569.21
Thickness (mm)1.831.591.834.571.834.574.571.834.571.59
Pitch (mm)1.271.271.272.541.272.542.541.272.541.27
Max Height (mm)2.032.032.035.082.035.085.082.035.082.03
Mechanical DataDownloadDownloadDownloadDownloadDownloadDownloadDownloadDownloadDownloadDownload
Device Marking37301B2AJM38510/JM38510/JM38510/SN54ALS02AJ86844012ASNJ54ALS02AJSNJ54ALS02AW

Parametrics

Parameters / Models5962-86844012A
5962-86844012A
5962-8684401DA
5962-8684401DA
JM38510/37301B2A
JM38510/37301B2A
JM38510/37301BCA
JM38510/37301BCA
M38510/37301B2A
M38510/37301B2A
M38510/37301BCA
M38510/37301BCA
SN54ALS02AJ
SN54ALS02AJ
SNJ54ALS02AFK
SNJ54ALS02AFK
SNJ54ALS02AJ
SNJ54ALS02AJ
SNJ54ALS02AW
SNJ54ALS02AW
Bits4444444444
F @ Nom Voltage(Max), Mhz75757575757575757575
ICC @ Nom Voltage(Max), mA0.0040.0040.0040.0040.0040.0040.0040.0040.0040.004
Input TypeTTLTTLTTLTTLTTLTTLTTLTTLTTLTTL
Operating Temperature Range, C-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125
Output Drive (IOL/IOH)(Max), mA0.4/-80.4/-80.4/-80.4/-80.4/-80.4/-80.4/-80.4/-80.4/-80.4/-8
Output TypeTTLTTLTTLTTLTTLTTLTTLTTLTTLTTL
Package GroupLCCCCFPLCCCCDIPLCCCCDIPCDIPLCCCCDIPCFP
Package Size: mm2:W x L, PKG20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CFP)20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CDIP)20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CDIP)See datasheet (CDIP)20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CDIP)See datasheet (CFP)
RatingMilitaryMilitaryMilitaryMilitaryMilitaryMilitaryMilitaryMilitaryMilitaryMilitary
Schmitt TriggerNoNoNoNoNoNoNoNoNoNo
Technology FamilyALSALSALSALSALSALSALSALSALSALS
VCC(Max), V5.55.55.55.55.55.55.55.55.55.5
VCC(Min), V4.54.54.54.54.54.54.54.54.54.5
tpd @ Nom Voltage(Max), ns16161616161616161616

Eco Plan

5962-86844012A5962-8684401DAJM38510/37301B2AJM38510/37301BCAM38510/37301B2AM38510/37301BCASN54ALS02AJSNJ54ALS02AFKSNJ54ALS02AJSNJ54ALS02AW
RoHSSee ti.comSee ti.comSee ti.comSee ti.comSee ti.comSee ti.comSee ti.comSee ti.comSee ti.comSee ti.com

Application Notes

  • Advanced Schottky (ALS and AS) Logic Families
    PDF, 1.9 Mb, File published: Aug 1, 1995
    This document introduces the advanced Schottky family of clamped TTL integrated circuits (ICs). Detailed electrical characteristics of the 'AS and 'ALS devices with table formats are provided. Guidelines for designing high-performance digital systems using the Advanced Schottky family are given along with a brief summary of the solutions to most design decisions needed to implement systems using t
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    PDF, 105 Kb, Revision: A, File published: Aug 1, 1997
    The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
  • Input and Output Characteristics of Digital Integrated Circuits
    PDF, 1.7 Mb, File published: Oct 1, 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Kb, File published: Aug 29, 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
  • Live Insertion
    PDF, 150 Kb, File published: Oct 1, 1996
    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, Revision: C, File published: Dec 2, 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, File published: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Designing With Logic (Rev. C)
    PDF, 186 Kb, Revision: C, File published: Jun 1, 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • Introduction to Logic
    PDF, 93 Kb, File published: Apr 30, 2015

Model Line

Manufacturer's Classification

  • Semiconductors> Space & High Reliability> Logic Products> Gate Products