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Datasheet Texas Instruments SN54AS867

Datasheet Texas Instruments SN54AS867

ManufacturerTexas Instruments

Synchronous 8-Bit Up/Down Counters


  • Download » Datasheet PDF, 367 Kb, Revision: C, File published: Jan 1, 1995
    Synchronous 8-Bit Up/Down Counters datasheet
    Docket ↓
    SN54AS867, SN54AS869
    SN74ALS867A, SN74ALS869, SN74AS867, SN74AS869
    SDAS115C – DECEMBER 1982 – REVISED JANUARY 1995 Fully Programmable With Synchronous
    Counting and Loading
    SN74ALS867A and ′AS867 Have
    Asynchronous Clear; SN74ALS869 and
    ′AS869 Have Synchronous Clear
    Fully Independent Clock Circuit
    Simplifies Use
    Ripple-Carry Output for n-Bit Cascading
    Package Options Include Plastic
    Small-Outline (DW) Packages, Ceramic
    Chip Carriers (FK), and Standard Plastic
    (NT) and Ceramic (JT) 300-mil DIPs SN54AS867, SN54AS869 . JT PACKAGE
    SN74ALS867A, SN74ALS869, SN74AS867,
    (TOP VIEW) S0
    D ...


Family: SN54AS867, SN54AS869, SN74ALS867A, SN74ALS869, SN74AS867, SN74AS869


Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNo


Package TypeJTJTJT
Package QTY111
Width (mm)6.926.926.92
Length (mm)323232
Thickness (mm)
Pitch (mm)2.542.542.54
Max Height (mm)
Mechanical DataDownload »Download »Download »
Device MarkingSN54AS867JT5962-8966801LA


F @ Nom Voltage(Max), Mhz125125125
ICC @ Nom Voltage(Max), mA195195195
Operating Temperature Range, C-55 to 125-55 to 125-55 to 125
Output Drive (IOL/IOH)(Max), mA20/-220/-220/-2
Package Size: mm2:W x L, PKGSee datasheet (CDIP)See datasheet (CDIP)See datasheet (CDIP)
Schmitt TriggerNoNoNo
Technology FamilyASASAS
VCC(Max), V5.55.55.5
VCC(Min), V4.54.54.5
Voltage(Nom), V555
tpd @ Nom Voltage(Max), ns222222

Eco Plan

RoHSSee ti.comSee ti.comSee

Application Notes

  • Download » Application Notes PDF, 1.7 Mb, File published: Oct 1, 1996
    Input and Output Characteristics of Digital Integrated Circuits
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • Download » Application Notes PDF, 1.9 Mb, File published: Aug 1, 1995
    Advanced Schottky (ALS and AS) Logic Families
    This document introduces the advanced Schottky family of clamped TTL integrated circuits (ICs). Detailed electrical characteristics of the 'AS and 'ALS devices with table formats are provided. Guidelines for designing high-performance digital systems using the Advanced Schottky family are given along with a brief summary of the solutions to most design decisions needed to implement systems using t
  • Download » Application Notes PDF, 380 Kb, File published: Aug 29, 2002
    TI IBIS File Creation Validation and Distribution Processes
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
  • Download » Application Notes PDF, 277 Kb, File published: Feb 1, 1997
    Advanced Schottky Load Management
    Designers of high-speed systems that include advanced Schottky (AS) devices must consider the operating environment in their work. They must be aware of the individual device characteristics and their interaction with other devices. This document provides a detailed discussion of the waveform characteristics equivalent circuit models transmission line fanout and termination for AS load manageme
  • Download » Application Notes PDF, 150 Kb, File published: Oct 1, 1996
    Live Insertion
    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • Download » Application Notes PDF, 614 Kb, Revision: C, File published: Dec 2, 2015
    Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
  • Download » Application Notes PDF, 337 Kb, File published: Jul 8, 2004
    Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Download » Application Notes PDF, 186 Kb, Revision: C, File published: Jun 1, 1997
    Designing With Logic (Rev. C)
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • Download » Application Notes PDF, 93 Kb, File published: Apr 30, 2015
    Introduction to Logic

Moldel Line

Series: SN54AS867 (3)

Manufacturer's Classification

  • Semiconductors> Space & High Reliability> Logic Products> Specialty Logic Products> Counter/Arithmetic/Parity Function Products

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