Datasheet Texas Instruments SN54F27

Manufacturer	Texas Instruments
Series	SN54F27

Datasheets

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Status

Packaging

Parametrics

Parameters / Models	5962-89510012A	5962-8951001CA	SNJ54F27FK	SNJ54F27J
Bits	3	3	3	3
F @ Nom Voltage(Max), Mhz	70	70	70	70
ICC @ Nom Voltage(Max), mA	0.012	0.012	0.012	0.012
Input Type	TTL	TTL	TTL	TTL
Operating Temperature Range, C	-55 to 125	-55 to 125	-55 to 125	-55 to 125
Output Drive (IOL/IOH)(Max), mA	1/-20	1/-20	1/-20	1/-20
Output Type	TTL	TTL	TTL	TTL
Package Group	LCCC	CDIP	LCCC	CDIP
Package Size: mm2:W x L, PKG	20LCCC: 79 mm2: 8.89 x 8.89(LCCC)	See datasheet (CDIP)	20LCCC: 79 mm2: 8.89 x 8.89(LCCC)	See datasheet (CDIP)
Rating	Military	Military	Military	Military
Schmitt Trigger	No	No	No	No
Technology Family	F	F	F	F
VCC(Max), V	5.5	5.5	5.5	5.5
VCC(Min), V	4.5	4.5	4.5	4.5
tpd @ Nom Voltage(Max), ns	6	6	6	6

Eco Plan

Application Notes

• Download
  Input and Output Characteristics of Digital Integrated Circuits
  PDF, 1.7 Mb, File published: Oct 1, 1996
  This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
• Download
  TI IBIS File Creation Validation and Distribution Processes
  PDF, 380 Kb, File published: Aug 29, 2002
  The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
• Download
  Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
  PDF, 105 Kb, Revision: A, File published: Aug 1, 1997
  The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
• Download
  Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
  PDF, 614 Kb, Revision: C, File published: Dec 2, 2015
• Download
  Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
  PDF, 337 Kb, File published: Jul 8, 2004
  Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
• Download
  Designing With Logic (Rev. C)
  PDF, 186 Kb, Revision: C, File published: Jun 1, 1997
  Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
• Download
  Introduction to Logic
  PDF, 93 Kb, File published: Apr 30, 2015

Model Line

Manufacturer's Classification

• Semiconductors> Space & High Reliability> Logic Products> Gate Products