Datasheet Texas Instruments SN54HC132

ManufacturerTexas Instruments
SeriesSN54HC132
Datasheet Texas Instruments SN54HC132

Quadruple Positive-NAND Gates With Schmitt-trigger Inputs

Datasheets

SNx4HC132 Quadruple Positive-NAND Gates With Schmitt-Trigger Inputs datasheet
PDF, 2.0 Mb, Revision: G, File published: Jun 30, 2016
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Prices

Status

5962-89845022A5962-8984502CA5962-8984502DASN54HC132JSNJ54HC132FKSNJ54HC132JSNJ54HC132W
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNoNoNoNoNo

Packaging

5962-89845022A5962-8984502CA5962-8984502DASN54HC132JSNJ54HC132FKSNJ54HC132JSNJ54HC132W
N1234567
Pin20141414201414
Package TypeFKJWJFKJW
Industry STD TermLCCCCDIPCFPCDIPLCCCCDIPCFP
JEDEC CodeS-CQCC-NR-GDIP-TR-GDFP-FR-GDIP-TS-CQCC-NR-GDIP-TR-GDFP-F
Package QTY1111111
CarrierTUBETUBETUBETUBETUBETUBETUBE
Width (mm)8.896.675.976.678.896.675.97
Length (mm)8.8919.569.2119.568.8919.569.21
Thickness (mm)1.834.571.594.571.834.571.59
Pitch (mm)1.272.541.272.541.272.541.27
Max Height (mm)2.035.082.035.082.035.082.03
Mechanical DataDownloadDownloadDownloadDownloadDownloadDownloadDownload
Device MarkingSN54HC132J89845022ASNJ54HC132JSNJ54HC132W

Parametrics

Parameters / Models5962-89845022A
5962-89845022A
5962-8984502CA
5962-8984502CA
5962-8984502DA
5962-8984502DA
SN54HC132J
SN54HC132J
SNJ54HC132FK
SNJ54HC132FK
SNJ54HC132J
SNJ54HC132J
SNJ54HC132W
SNJ54HC132W
Bits4444444
F @ Nom Voltage(Max), Mhz70707070707070
ICC @ Nom Voltage(Max), mA0.020.020.020.020.020.020.02
Input TypeCMOSCMOSCMOSCMOSCMOSCMOSCMOS
Operating Temperature Range, C-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125
Output Drive (IOL/IOH)(Max), mA5.2/-5.25.2/-5.25.2/-5.25.2/-5.25.2/-5.25.2/-5.25.2/-5.2
Output TypeCMOSCMOSCMOSCMOSCMOSCMOSCMOS
Package GroupLCCCCDIPCFPCDIPLCCCCDIPCFP
Package Size: mm2:W x L, PKG20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CDIP)See datasheet (CFP)See datasheet (CDIP)20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CDIP)See datasheet (CFP)
RatingMilitaryMilitaryMilitaryMilitaryMilitaryMilitaryMilitary
Schmitt TriggerYesYesYesYesYesYesYes
Technology FamilyHCHCHCHCHCHCHC
VCC(Max), V6666666
VCC(Min), V2222222
tpd @ Nom Voltage(Max), ns31313131313131

Eco Plan

5962-89845022A5962-8984502CA5962-8984502DASN54HC132JSNJ54HC132FKSNJ54HC132JSNJ54HC132W
RoHSSee ti.comSee ti.comSee ti.comSee ti.comSee ti.comSee ti.comSee ti.com

Application Notes

  • Input and Output Characteristics of Digital Integrated Circuits
    PDF, 1.7 Mb, File published: Oct 1, 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • SN54/74HCT CMOS Logic Family Applications and Restrictions
    PDF, 102 Kb, File published: May 1, 1996
    The TI SN54/74HCT family of CMOS devices is a subgroup of the SN74HC series with the HCT circuitry modified to meet the interfacing requirements of TTL outputs to high-speed CMOS inputs. The HCT devices can be driven by the TTL circuits directly without additional components. This document describes the TTL/HC interface the operating voltages circuit noise and power consumption. A Bergeron anal
  • Selecting the Right Texas Instruments Signal Switch
    PDF, 769 Kb, File published: Sep 7, 2001
    Texas Instruments offers a wide variety of electronic switches (digital analog bilateral bilateral analog) in a variety of families including CBT CBTLV HC LV and LVC. Depending on the application the right solution may be an analog switch that passes digital signals or vice versa. This application report summarizes the various switching technologies and provides considerations for choosi
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Kb, File published: Aug 29, 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
  • Live Insertion
    PDF, 150 Kb, File published: Oct 1, 1996
    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, Revision: C, File published: Dec 2, 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, File published: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Designing With Logic (Rev. C)
    PDF, 186 Kb, Revision: C, File published: Jun 1, 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • Introduction to Logic
    PDF, 93 Kb, File published: Apr 30, 2015
  • Implications of Slow or Floating CMOS Inputs (Rev. D)
    PDF, 260 Kb, Revision: D, File published: Jun 23, 2016
  • CMOS Power Consumption and CPD Calculation (Rev. B)
    PDF, 89 Kb, Revision: B, File published: Jun 1, 1997
    Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale
  • Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc
    PDF, 43 Kb, File published: Apr 1, 1996
    Though low power consumption is a feature of CMOS devices sometimes this feature does not meet a designer?s system power supply constraints. Therefore a partial system power down or multiple Vcc supplies are used to meet the needs of the system. This document shows electrostatic discharge protection circuits. It also provides circuit and bus driver examples of partial system power down and curren

Model Line

Manufacturer's Classification

  • Semiconductors> Space & High Reliability> Logic Products> Gate Products
EMS supplier