Datasheet Texas Instruments SN74CBTK32245

Manufacturer	Texas Instruments
Series	SN74CBTK32245

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Parametrics

Parameters / Models	SN74CBTK32245ZKER
Additional Features	Powered off protection,-2V undershoot protection
Bandwidth, MHz	200
Configuration	1:1 SPST
ESD Charged Device Model, kV	1
ESD HBM, kV	2
Input/Ouput Voltage(Max), V	5.5
Input/Output Continuous Current(Max), mA	128
Input/Output OFF-state Capacitance(Typ), pF	5.5
Number of Channels	32
OFF-state leakage current(Max), µA	5
ON-state leakage current(Max), µA	5
Operating Temperature Range, C	-40 to 85
Package Group	LFBGA
Package Size: mm2:W x L, PKG	96LFBGA: 74 mm2: 5.5 x 13.5(LFBGA)
Rating	Catalog
Ron(Max), Ohms	20
Ron(Typ), Ohms	5
Supply Current(Max), uA	20
Supply Range, Max	5.5
VIH(Min), V	2
VIL(Max), V	0.8
Vdd(Max), V	5.5
Vdd(Min), V	4
Vss(Max), V	N/A
Vss(Min), V	N/A

Eco Plan

Application Notes

• Download
  Flexible Voltage-Level Translation With CBT Family Devices
  PDF, 40 Kb, File published: Jul 20, 1999
  Voltage translation between buses with incompatible logic levels can be accomplished using Texas Instruments (TI) translation-voltage clamps (TVC) or standard crossbar technology (CBT) devices. CBT devices in this application offer flexibility in designs, protection of circuits that are sensitive to high-state voltage-level overshoots, and cost efficiency.
• Download
  5-V To 3.3-V Translation With the SN74CBTD3384 (Rev. B)
  PDF, 35 Kb, Revision: B, File published: Mar 1, 1997
  The emergence of low-voltage technology required existing 5-V systems to interact with 3.3-V systems. Compatibility issues of mixed-mode operation created the need for 5-V to 3.3-V translation. Buffers and transceivers serve as effective translators. While providing additional drive, these devices also add propagation delay and require directional control. In cases where additional drive is not
• Download
  3.3-V to 2.5-V Translation with Texas Instruments Crossbar Technology (Rev. A)
  PDF, 32 Kb, Revision: A, File published: Apr 3, 1998
• Download
  Bus FET Switch Solutions for Live Insertion Applications
  PDF, 300 Kb, File published: Feb 7, 2003
  In today?s competitive computing and networking industry, any equipment downtime due to component interconnects or bus failures impedes communication, hinders productivity and hampers financial growth. In recognizing this increasingly costly unplanned downtime, the industry introduced live-insertion technology to minimize the impact of any such failures. The live-insertion feature enables a networ

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Manufacturer's Classification

• Semiconductors> Switches and Multiplexers> Analog Switches/Muxes