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Package Intersil V100.11x11

Package Intersil V100.11x11

ManufacturerIntersil
SeriesBGA
Part NumberV100.11x11

100 Plastic Ball Grid Array Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Plastic Ball Grid Array Packages (BGA)
    o V100.11x11 A1
    CORNER 100 BALL PLASTIC BALL GRID ARRAY PACKAGE
    A INCHES D
    A1
    CORNER I.D. E B
    TOP VIEW
    0.15
    M C
    0.006
    0.08
    0.003 M C A B A1
    CORNER D1
    10 9 8 7 6 5 4 3 2 1 S A1
    CORNER I.D.
    A
    B
    C
    D
    E
    F
    G E1 ...

Parametrics

FamilyFBGA
Pin Count100
Length11.00 mm
Width11.00 mm
Peak Temperature240 °C
FeaturesFine
Package IndexV100.11X11

Moldel Line

Series: BGA (14)

Manufacturer's Classification

  • Plastic Packages
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