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Package Intersil V144.7x7A

Package Intersil V144.7x7A

ManufacturerIntersil
SeriesBGA
Part NumberV144.7x7A

144 Lead Thin, Fine Pitch Plastic ball Grid Array Package (TFBGA)

Package Outline Drawing (POD)

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    Status of Document is: RELEASED Effective from: 2011-01-14 18:48:54 EST to Controlled Document Package Outline Drawing
    V144.7X7A
    144 Lead Thin, Fine Pitch Plastic ball Grid Array Package (TFBGA)
    Rev 0, 1/11 TOP VIEW BOTTOM VIEW
    в€…0.05
    в€…0.15 A1 CORNER M
    M C
    C AB A1 CORNER в€…0.27~0.37
    1 2 3 4 5 6 7 8 9 10 11 12
    A
    B
    C
    E D E1 E
    F
    G A e b M // 0.10 C D1
    D B
    0.10 C A
    SEATING PLANE
    S C A1
    0.08 C Title:
    Specification Type: POD
    144 Lead Thin, Fine Pitch Plastic ball Grid Array Package (TFBGA) Specification Number : V144.7X7A
    Issue : 0 ...

Parametrics

FamilyTFBGA
Pin Count144
Length7 mm
Width7 mm
Weight0.069 g
Peak Temperature235 °C
Lead Free Peak Temperature260 °C
FeaturesThin, Fine
Package IndexV144.7X7A

Moldel Line

Series: BGA (14)

Manufacturer's Classification

  • Plastic Packages

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