Package Intersil V172.8x8

ManufacturerIntersil
SeriesBGA
Part NumberV172.8x8
Package Intersil V172.8x8

172 Thin, Fine Pitch Ball Grid Array Package

Package Outline Drawing (POD)

PDF, 145 Kb
Docket

Parametrics

FamilyTFBGA
Pin Count172
Length8.00 mm
Width8.00 mm
Thickness1.20 mm
Weight0.095 g
Pitch0.50 mm
Peak Temperature235 °C
Lead Free Peak Temperature260 °C
FeaturesThin, Fine
Package IndexV172.8X8

Model Line

Manufacturer's Classification