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Package Intersil V172.8x8

Package Intersil V172.8x8

ManufacturerIntersil
SeriesBGA
Part NumberV172.8x8

172 Thin, Fine Pitch Ball Grid Array Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    V172.8x8
    172 THIN, FINE PITCH BALL GRID ARRAY PACKAGE
    Rev 0, 12/12
    COMMON DIMENSIONS
    SYMBOL
    PIN A1 CORNER MIN NOM Package TFBGA Body Size X E 8.000 Y D 8.000 e 0.500 Ball Pitch
    Total Thickness A Mold Thickness M 0.530 Ref. 1.200 Substrate Thickness S 0.260 Ref. Ball Diameter TOP VIEW MAX 0.300 Stand Off A1 0.160 -0.500 Ball Width b 0.270 -0.600 Package Edge Tolerance aaa 0.100 Mold Parallelism bbb 0.100 Coplanarity ddd 0.080 Ball Offset (Package) eee 0.150 Ball Offset (Ball) fff 0.080 Ball Count n 172 Edge Ball Center to Center X E1 6.500 Y D1 6.500 NOTES:
    1. Dimensions are in millimeters.
    3 4 5 6 7 8 9 10 11 D1 D 12 13 14 2. Dimensioning and tolerancing conform to ASME Y 14.5M-1994.
    3. “N” is the total number of balls.
    P
    N
    M
    L
    K
    J
    H
    G
    F
    E
    D
    C ...

Parametrics

FamilyTFBGA
Pin Count172
Length8.00 mm
Width8.00 mm
Thickness1.20 mm
Weight0.095 g
Pitch0.50 mm
Peak Temperature235 °C
Lead Free Peak Temperature260 °C
FeaturesThin, Fine
Package IndexV172.8X8

Moldel Line

Series: BGA (14)

Manufacturer's Classification

  • Plastic Packages

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