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Package Intersil V196.12x12

Package Intersil V196.12x12

ManufacturerIntersil
SeriesBGA
Part NumberV196.12x12

196 Plastic Ball Grid Array Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Plastic Ball Grid Array Packages (BGA)
    o A A1 CORNER V196.12x12 D 196 BALL PLASTIC BALL GRID ARRAY PACKAGE
    INCHES A1 CORNER I.D. E B
    TOP VIEW
    0.15
    M C A B
    0.006
    0.08
    M C
    0.003
    b A1
    CORNER D1 14 13 12 11 10 9 8 7 6 5 4 3 2 1 S A S
    A A1
    CORNER I.D. MIN MAX MIN MAX NOTES A -0.059 -1.50 -A1 0.012 0.016 0.31 0.41 -A2 0.037 0.044 0.93 1.11 -b 0.016 0.020 0.41 0.51 7 D/E 0.468 0.476 11.90 12.10 -D1/E1 0.405 0.413 10.30 10.50 -N 196 196 -e 0.032 BSC 0.80 BSC -MD/ME 14 x 14 14 x 14 3 bbb 0.004 0.10 -aaa 0.005 0.12 Rev. 2 12/00 NOTES:
    1. Controlling dimension: MILLIMETER. Converted inch
    dimensions are not necessarily exact. e 7. Dimension “b” is measured at the maximum ball diameter,
    parallel to the primary datum C. 2. Dimensioning and tolerancing conform to ASME Y14.5M-1994.
    3. “MD” and “ME” are the maximum ball matrix size for the “D”
    and “E” dimensions, respectively.
    4. “N” is the maximum number of balls for the specific array size.
    5. Primary datum C and seating plane are defined by the spherical crowns of the contact balls.
    6. Dimension “A” includes standoff height “A1”, package body ...

Parametrics

FamilyFBGA
Pin Count196
Length12.00 mm
Width12.00 mm
Thickness1.02 mm
Height max1.50 mm
Weight0.38 g
Pitch0.80 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
FeaturesFine
Package IndexV196.12X12

Moldel Line

Series: BGA (14)

Manufacturer's Classification

  • Plastic Packages
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