RadioLocman.com Electronics ru
Advanced Search +
  

Package Intersil V196.15x15

Package Intersil V196.15x15

ManufacturerIntersil
SeriesBGA
Part NumberV196.15x15

196 Plastic Ball Grid Array Package

Package Outline Drawing (POD)

  • Download » PDF, 21 Kb
    Docket ↓
    Plastic Packages for Integrated Circuits
    Plastic Ball Grid Array Packages (BGA)
    o A A1 CORNER V196.15x15 D 196 BALL PLASTIC BALL GRID ARRAY PACKAGE
    INCHES A1 CORNER I.D. E B
    TOP VIEW
    0.15
    M C A B
    0.006
    0.08
    M C
    0.003
    b A1
    CORNER D1 14 13 12 11 10 9 8 7 6 5 4 3 2 1 S A S
    A A1
    CORNER I.D. MIN MAX MIN MAX NOTES A -0.059 -1.50 -A1 0.012 0.016 0.31 0.41 -A2 0.037 0.044 0.93 1.11 -b 0.016 0.020 0.41 0.51 7 D/E 0.587 0.595 14.90 15.10 -D1/E1 0.508 0.516 12.90 13.10 -N 196 196 -e 0.039 BSC 1.0 BSC -MD/ME 14 x 14 14 x 14 3 bbb 0.004 0.10 -aaa 0.005 0.12 Rev. 1 12/00 NOTES:
    1. Controlling dimension: MILLIMETER. Converted inch
    dimensions are not necessarily exact. e 7. Dimension “b” is measured at the maximum ball diameter,
    parallel to the primary datum C. 2. Dimensioning and tolerancing conform to ASME Y14.5M-1994.
    3. “MD” and “ME” are the maximum ball matrix size for the “D”
    and “E” dimensions, respectively.
    4. “N” is the maximum number of balls for the specific array size.
    5. Primary datum C and seating plane are defined by the spherical crowns of the contact balls.
    6. Dimension “A” includes standoff height “A1”, package body ...

Parametrics

FamilyFBGA
Pin Count196
Thickness1.02 mm
Height max1.50 mm
Weight0.54 g
Pitch1.00 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
FeaturesFine
Package IndexV196.15X15

Moldel Line

Series: BGA (14)

Manufacturer's Classification

  • Plastic Packages
Slices ↓
Radiolocman facebook Radiolocman twitter Radiolocman google plus