Package Intersil V256.13.5x13.5

ManufacturerIntersil
SeriesBGA
Part NumberV256.13.5x13.5
Package Intersil V256.13.5x13.5

256 Low Profile, Fine Pitch Plastic Ball Grid Array Package

Package Outline Drawing (POD)

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Parametrics

FamilyLFBGA
Pin Count256
Height max1.70 mm
Weight0.722 g
Pitch0.80 mm
Peak Temperature235 °C
Lead Free Peak Temperature260 °C
FeaturesLow Profile, Fine
Package IndexV256.13.5X13.5

Model Line

Manufacturer's Classification

  • Plastic Packages
EMS supplier