Package Intersil V256.13.5x13.5

ManufacturerIntersil
SeriesBGA
Part NumberV256.13.5x13.5
Package Intersil V256.13.5x13.5

256 Low Profile, Fine Pitch Plastic Ball Grid Array Package

Package Outline Drawing (POD)

PDF, 211 Kb
Docket

Parametrics

FamilyLFBGA
Pin Count256
Height max1.70 mm
Weight0.722 g
Pitch0.80 mm
Peak Temperature235 °C
Lead Free Peak Temperature260 °C
FeaturesLow Profile, Fine
Package IndexV256.13.5X13.5

Model Line

Manufacturer's Classification