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Package Intersil V256.13.5x13.5

Package Intersil V256.13.5x13.5

ManufacturerIntersil
SeriesBGA
Part NumberV256.13.5x13.5

256 Low Profile, Fine Pitch Plastic Ball Grid Array Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    V256.13.5x13.5
    256 LOW PROFILE, FINE PITCH PLASTIC BALL GRID ARRAY PACKAGE (LFBGA)
    Rev 0, 3/13 3 X 13.50 PIN A1
    CORNER COMMON
    DIMENSIONS Y 4 SYMBOL MIN Package
    Body Size
    13.50 0.20
    TOP VIEW aaa(4X)
    E A
    A1 BALL PAD
    CORNER
    B E1 Г?b(n X)
    Г?eee M C A B
    Г?fff M C e
    A
    B
    C
    D
    E
    F
    G
    H ...

Parametrics

FamilyLFBGA
Pin Count256
Height max1.70 mm
Weight0.722 g
Pitch0.80 mm
Peak Temperature235 °C
Lead Free Peak Temperature260 °C
FeaturesLow Profile, Fine
Package IndexV256.13.5X13.5

Moldel Line

Series: BGA (14)

Manufacturer's Classification

  • Plastic Packages
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