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Package Intersil L10.3x3

Package Intersil L10.3x3

ManufacturerIntersil
SeriesDFN
Part NumberL10.3x3

10 LEAD DUAL FLAT PACKAGE (DFN)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L10.3x3
    10 LEAD DUAL FLAT PACKAGE (DFN)
    Rev 11, 3/15
    3.00 5
    PIN #1 INDEX AREA A
    B
    1 5
    PIN 1
    INDEX AREA (4X) 3.00 2.00
    8x 0.50 2 10 x 0.23 0.10
    1.60 TOP VIEW 10x 0.35 BOTTOM VIEW
    (4X) 0.10 M C A B 0.415
    0.200 0.23 0.35 (10 x 0.55) SEE DETAIL "X" (10x 0.23)
    1.00
    MAX 0.10 C 0.20 2.00
    (8x 0.50) BASE PLANE C SEATING PLANE
    0.08 C
    SIDE VIEW 0.415
    C 1.60 0.20 REF 4 0.05
    2.85 TYP DETAIL "X" TYPICAL RECOMMENDED LAND PATTERN NOTES: 1 1. Dimensions are in millimeters.
    Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal В± 0.05 4. Tiebar shown (if present) is a non-functional feature and may be
    located on any of the 4 sides (or ends). 5. The configuration of the pin #1 identifier is optional, but must be ...

Parametrics

FamilyDFN
Pin Count10
Length3.00 mm
Width3.00 mm
Thickness0.90 mm
Height max1.00 mm
Weight0.022 g
Pitch0.50 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL10.3X3

Moldel Line

Series: DFN (43)

Manufacturer's Classification

  • Plastic Packages
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