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Package Intersil V256.17x17C

Package Intersil V256.17x17C

ManufacturerIntersil
SeriesBGA
Part NumberV256.17x17C

256 PLASTIC BALL GRID ARRAY PACKAGE (PBGA)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    V256.17x17C
    256 PLASTIC BALL GRID ARRAY PACKAGE (PBGA)
    Rev 0, 6/13
    √Ш0.50(3X). REF COMMON
    SYMBOL DIEMENSIONS 1 2 3 4 5 6 7 8 9 10 1112 13 14 15 16 Package PBGA Body Size X D 17.00 Y E 17.00 X eD 1.000 Y eE 1.000 Total Thickness A 1.810 ¬±0.190 Mold Thickness A3 0.850 Ref. Substrate Thickness A2 0.560 Ref. Ball Diameter 0.500 Stand Off A1 0.300 ~ 0.500 Ball Width b 0.400 ~ 0.600 Mold Area CA(4X) X M 15.000 Y N 15.000 Chamfer CA 1.215*45¬∞. Package Edge Tolerance aaa 0.200 Substrate Flatness bbb 0.250 Mold Flatness ccc 0.350 Coplanarity ddd 0.150 Ball Offset (Package) eee 0.250 Ball Offset (Ball) fff 0.100 Ball Count n 256 X D1 15.000 Y E1 15.000 M √Шeee M C A B
    √Шb(n X)
    16 15 14 13 1211 10 9 8 7 6 5 4 3 2 1 E E1 eE A
    B
    C
    D
    E
    F
    G
    H
    J
    K
    L
    M
    N
    P
    R
    T ...

Parametrics

FamilyPBGA
Pin Count256
Length17 mm
Width17 mm
Thickness1.40 mm
Height max1.60 mm
Weight0.809 g
Pitch0.50 mm
Peak Temperature235 °C
Lead Free Peak Temperature260 °C
FeaturesPlastic
Package IndexV256.17X17C

Moldel Line

Series: BGA (14)

Manufacturer's Classification

  • Plastic Packages
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