Package Intersil V356.27x27C
356 Ball Heatsink Plastic Ball Grid Array Package (HPBGA)
Package Outline Drawing (POD)
Parametrics
| Family | HBGA |
| Pin Count | 356 |
| Length | 27.00 mm |
| Width | 27.00 mm |
| Weight | 2.61 g |
| Pitch | 1.27 mm |
| Lead Free Peak Temperature | 260 °C |
| Features | Heat-Sink |
| Package Index | V356.27X27C |
Model Line
Series: BGA (14)
Manufacturer's Classification
- Plastic Packages