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Package Intersil V416.27x27

Package Intersil V416.27x27

ManufacturerIntersil
SeriesBGA
Part NumberV416.27x27

416 Plastic Ball Grid Array Package (Cavity Down)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    V416.27x27
    416 PLASTIC BALL GRID ARRAY PACKAGE (CAVITY DOWN)
    Rev 0, 9/11
    √Ш0.100 M C
    √Ш0.250 M C A B 3 PIN A1 CORNER EPOXY ENCAPSULANT
    √Ш1.00(3X). REF √Ш0.5-0.7(416 X) 1.00 A
    B
    C
    D
    E
    F
    G
    H
    J
    K
    L
    M
    N
    P
    R
    T
    U ...

Parametrics

FamilyPBGA
Pin Count416
Weight2.28 g
Pitch25.40 mm
Peak Temperature235 °C
Lead Free Peak Temperature260 °C
FeaturesPlastic
Package IndexV416.27X27

Moldel Line

Series: BGA (14)

Manufacturer's Classification

  • Plastic Packages
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