Package Intersil S3x3.9

ManufacturerIntersil
SeriesCSP
Part NumberS3x3.9

3x3 Array 9 Bump Optical Chip Scale Package (OCSP)

Package Outline Drawing (POD)

PDF, 97 Kb
Docket

Parametrics

FamilyCSP
Pin Count9
Length2.16 mm
Width2.16 mm
Height max1.05 mm
Weight0.00924 g
Pitch0.65 mm
Lead Free Peak Temperature250 °C
Package IndexS3X3.9

Model Line

Series: CSP (1)
  • S3x3.9

Manufacturer's Classification