RadioLocman.com Electronics ru
Advanced Search +
  

Package Intersil S3x3.9

ManufacturerIntersil
SeriesCSP
Part NumberS3x3.9

3x3 Array 9 Bump Optical Chip Scale Package (OCSP)

Package Outline Drawing (POD)

  • Download » PDF, 97 Kb
    Docket ↓
    Plastic Packages for Integrated Circuits Package Outline Drawing
    S3x3.9
    3X3 ARRAY 9 BUMP OPTICAL CHIP SCALE PACKAGE (OCSP)
    Rev 7, 10/10
    2.155 В±0.025 A1
    CORNER 1.30 A 0.65 B
    A1
    CORNER 3 2 1.30 1 A
    2.155 В±0.025 B
    C TOP VIEW
    0.30 В±0.03 5
    0.15 M C A B
    0.08 M C 0.65 BOTTOM VIEW 0.825 В±0.045 0.10 C
    1.045 MAX SEATING PLANE C
    0.16 В±0.03 0.10 C SIDE VIEW (1.30)
    (1.30)
    (0.65)
    NOTES:
    1. Dimensions are in millimeters.
    Dimensions in ( ) for Reference only.
    2. Dimensioning and tolerancing conform to ASME Y 14.5M-1994
    3. Primary datum C and seating plane are defined by the spherical
    crowns of the contact balls. ...

Parametrics

FamilyCSP
Pin Count9
Length2.16 mm
Width2.16 mm
Height max1.05 mm
Weight0.00924 g
Pitch0.65 mm
Lead Free Peak Temperature250 °C
Package IndexS3X3.9

Moldel Line

Series: CSP (1)
  • S3x3.9

Manufacturer's Classification

  • Plastic Packages
Slices ↓
Radiolocman facebook Radiolocman twitter Radiolocman google plus