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Package Intersil L12.3x3C

Package Intersil L12.3x3C

ManufacturerIntersil
SeriesDFN
Part NumberL12.3x3C

12 Lead Thin Dual Flat No-lead Plastic Package (0.4mm Pitch)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L12.3x3C
    12 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE (0.4mm PITCH)
    Rev 1, 4/15
    3.00 6
    PIN #1
    INDEX AREA A
    B 6
    PIN 1
    INDEX AREA 3.00 0.40 (4X) 2.45В±0.1 0.15 12x 0.20 0.10 M C A B
    4 0.20 В±0.05 1.70В±0.1
    TOP VIEW 12x 0.40
    BOTTOM VIEW PACKAGE
    OUTLINE SEE DETAIL "X"
    0.10 C C
    BASE PLANE
    SEATING PLANE
    0.08 C 0 . 75 (12 x0.20)
    SIDE VIEW 2.45 (10 x0.40) C
    1.70 (12 x0.20) 0 . 2 REF 5 0 . 00 MIN.
    0 . 05 MAX. (12 x0.40)
    TYPICAL RECOMMENDED LAND PATTERN DETAIL "X" NOTES: 1 1. Dimensions are in millimeters.
    Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal В± 0.05 4. Dimension applies to the metallized terminal and is measured ...

Parametrics

FamilyTDFN
Pin Count12
Length3.00 mm
Width3.00 mm
Thickness0.75 mm
Height max0.75 mm
Weight0.022 g
Pitch0.40 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL12.3X3C

Moldel Line

Series: DFN (43)

Manufacturer's Classification

  • Plastic Packages
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