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Package Intersil L14.4x3

Package Intersil L14.4x3

ManufacturerIntersil
SeriesDFN
Part NumberL14.4x3

14 Lead Thin Dual Flat No-lead Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L14.4x3
    14 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
    Rev 1, 4/15
    3.00 SEE DETAIL "X" A PIN #1
    INDEX AREA B
    6
    PIN 1
    INDEX AREA 14 4.00 (4X) 1 3.2 В±0.05 2X 3.00 7 8 0.10
    TOP VIEW 6 12X 0.50 14X 0.25 В±0.05
    0.80 MAX 0.10 M C A B
    C 1.70
    В±0.05 14X 0.40 В± 0.05 4 SIDE VIEW BOTTOM VIEW (14X 0.60)
    ( 14 X 0.25) 0.10 C
    C
    ( 3.20 ) 0 . 2 REF ( 3.00) SEATING PLANE
    0 . 00 MIN.
    0 . 05 MAX. 0.08 C DETAIL "X"
    (12x 0.50)
    (1.70)
    ( 2.80 )
    TYPICAL RECOMMENDED LAND PATTERN 1 NOTES:
    1. Dimensions are in millimeters. ...

Parametrics

FamilyTDFN
Pin Count14
Length4.00 mm
Width3.00 mm
Thickness0.75 mm
Weight0.032 g
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL14.4X3

Moldel Line

Series: DFN (43)

Manufacturer's Classification

  • Plastic Packages
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