RadioLocman.com Electronics ru
Advanced Search +
  

Package Intersil L8.2x2C

Package Intersil L8.2x2C

ManufacturerIntersil
SeriesDFN
Part NumberL8.2x2C

8 Lead Thin Dual Flat No-lead Plastic Package (TDFN) with E-PAD

Package Outline Drawing (POD)

  • Download » PDF, 82 Kb
    Docket ↓
    Plastic Packages for Integrated Circuits Package Outline Drawing
    L8.2x2C
    8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE (TDFN) WITH E-PAD
    Rev 1, 5/15
    2.00 6
    PIN #1 INDEX AREA A
    B 6
    PIN 1
    INDEX AREA 8 1 0.50
    2.00 1.45В±0.050
    Exp.DAP (4X) 0.15 0.25 0.10 M C A B ( 8x0.30 ) TOP VIEW 0.80В±0.050
    Exp.DAP BOTTOM VIEW ( 8x0.20 ) Package Outline ( 8x0.30 ) SEE DETAIL "X"
    ( 6x0.50 ) 1.45 2.00 0.10 C 0 . 75 ( 0 . 80 max) C BASE PLANE
    SEATING PLANE
    0.08 C SIDE VIEW ( 8x0.25 )
    0.80
    2.00 TYPICAL RECOMMENDED LAND PATTERN C 0 . 2 REF 0 . 00 MIN.
    0 . 05 MAX.
    DETAIL "X" NOTES:
    1. Dimensions are in millimeters.
    Dimensions in ( ) for Reference Only.
    2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
    3. Unless otherwise specified, tolerance : Decimal В± 0.05 ...

Parametrics

FamilyTDFN
Pin Count8
Thickness0.75 mm
Height max0.80 mm
Weight0.011 g
Pitch0.50 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL8.2X2C

Moldel Line

Series: DFN (43)

Manufacturer's Classification

  • Plastic Packages
Slices ↓
Radiolocman facebook Radiolocman twitter Radiolocman google plus