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Package Intersil L8.2x2D

Package Intersil L8.2x2D

ManufacturerIntersil
SeriesDFN
Part NumberL8.2x2D

8 Lead Dual Flat No-lead Plastic Package (DFN) With Exposed Pad

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L8.2x2D
    8 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE (DFN) WITH EXPOSED PAD
    Rev 1, 3/15
    2.00
    6
    PIN 1
    INDEX AREA 6
    PIN #1
    INDEX AREA A
    B
    8 1 2.00 6x 0.50 (4X) 1.55В±0.10 0.15 0.10M C A B 0.22
    4 TOP VIEW ( 8x0.30 )
    0.90В±0.10
    BOTTOM VIEW SEE DETAIL "X"
    C
    0.10 C
    0.90В±0.10
    BASE PLANE 0 . 00 MIN.
    0 . 05 MAX. SEATING PLANE
    0.08 C SIDE VIEW 0 . 2 REF C DETAIL "X" ( 8x0.20 ) PACKAGE
    OUTLINE ( 8x0.30 ) NOTES:
    1. Dimensions are in millimeters. ...

Parametrics

FamilyDFN
Pin Count8
Thickness0.90 mm
Height max1.00 mm
Weight0.011 g
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL8.2X2D

Moldel Line

Series: DFN (43)

Manufacturer's Classification

  • Plastic Packages
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