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Package Intersil L8.2x3A

Package Intersil L8.2x3A

ManufacturerIntersil
SeriesDFN
Part NumberL8.2x3A

8 Lead Thin Dual Flat No-Lead Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L8.2x3A
    8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE WITH E-PAD
    Rev 2, 05/15
    0.25 B 0.50 2.20 6
    PIN 1
    INDEX AREA (4X) 6
    PIN #1 INDEX AREA 3.00 A 1.80 +0.1/ -0.15 2.00 0.15
    (8x0.40)
    1.65 +0.1/ -0.15 TOP VIEW BOTTOM VIEW (8x0.25)
    PACKAGE
    OUTLINE (6x0.50) 0.75 SEE DETAIL "X" SIDE VIEW 1.80 3.00 0.05 (8x0.40)
    1.65 C 0.20 REF C
    BASE PLANE
    SEATING PLANE
    0.08 C 5 (8x0.20)
    0.05 2.00 TYPICAL RECOMMENDED LAND PATTERN DETAIL "X" NOTES:
    1. Dimensions are in millimeters.
    Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal В± 0.05 4. Dimension b applies to the metallized terminal and is measured
    between 0.20mm and 0.32mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature and may
    be located on any of the 4 sides (or ends). 6. The configuration of the pin #1 identifier is optional, but must be
    located within the zone indicated. The pin #1 indentifier may be
    either a mold or mark feature. 1 ...

Parametrics

FamilyTDFN
Pin Count8
Width3.00 mm
Thickness0.75 mm
Height max0.75 mm
Weight0.012 g
Pitch0.50 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL8.2X3A

Moldel Line

Series: DFN (43)

Manufacturer's Classification

  • Plastic Packages
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