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Package Intersil L8.3x3H

Package Intersil L8.3x3H

ManufacturerIntersil
SeriesDFN
Part NumberL8.3x3H

8 Lead Thin Dual Flat No-Lead Plastic Package (TDFN)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L8.3x3H
    8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE (TDFN)
    Rev 1, 5/15
    2.38
    1.50 REF
    3.00 A PIN #1 INDEX AREA 6
    PIN 1
    INDEX AREA 6 X 0.50 6
    B 1 8 X 0.40 4 2.20
    3.00 (4X) 1.64 0.15
    5 8 0.10 M C A B TOP VIEW 8 X 0.25 BOTTOM VIEW
    ( 2.38 )
    SEE DETAIL "X" 0 .80 MAX 0.10 C C BASE PLANE
    SEATING PLANE
    0.08 C 2 . 80 ( 2 .20 ) SIDE VIEW ( 1.64 ) C 0.2 REF 8X 0.60
    0 . 00 MIN.
    0 . 05 MAX.
    ( 8X 0.25 ) DETAIL “X” ( 6X 0 . 5 ) NOTES:
    TYPICAL RECOMMENDED LAND PATTERN 1. Dimensions are in millimeters.
    Dimensions in ( ) for Reference Only.
    2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
    3. Unless otherwise specified, tolerance : Decimal В± 0.05 ...

Parametrics

FamilyTDFN
Pin Count8
Length3.00 mm
Width3.00 mm
Thickness0.75 mm
Height max0.80 mm
Weight0.022 g
Pitch0.50 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL8.3X3H

Moldel Line

Series: DFN (43)

Manufacturer's Classification

  • Plastic Packages
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