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Package Intersil L9.3x3

Package Intersil L9.3x3

ManufacturerIntersil
SeriesDFN
Part NumberL9.3x3

9 Lead Dual Flat No-Lead Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Dual Flat No-Lead Plastic Package (DFN)
    L9.3x3 2X 9 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE 0.15 C A A D MILLIMETERS 2X
    0.15 C B E SYMBOL MIN
    0.80 0.90 1.00 -0.05 -0.20 REF
    0.20 D
    D2 B A
    C
    SEATING
    PLANE 0.08 C A3 SIDE VIEW D2 1 6 2.10 6, 7 -3.00 BSC
    0.80 e 0.95 1.05 6, 7 0.50 BSC -k 0.60 -L 0.25 0.35 0.45 7 9 2 D2/2 1. Dimensioning and tolerancing conform to ASME Y14.5-1994. 2 2. N is the number of terminals. E2/2 3. All dimensions are in millimeters. Angles are in degrees.
    4. Dimension b applies to the metallized terminal and is measured
    between 0.15mm and 0.30mm from the terminal tip. E2 5. The configuration of the pin #1 identifier is optional, but must be
    located within the zone indicated. The pin #1 identifier may be
    either a mold or mark feature. NX L
    N-1 6. Dimensions D2 and E2 are for the exposed pads which provide
    improved electrical and thermal performance. NX b e
    (Nd-1)Xe
    REF.
    BOTTOM VIEW 4
    0.10 M C A B (A1)
    8 L 4
    e SECTION "C-C" ...

Parametrics

FamilyDFN
Pin Count9
Length3.00 mm
Width3.00 mm
Thickness0.90 mm
Height max1.00 mm
Weight0.022 g
Pitch0.50 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL9.3X3

Moldel Line

Series: DFN (43)

Manufacturer's Classification

  • Plastic Packages
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