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Package Intersil Q128.14x20A

Package Intersil Q128.14x20A

ManufacturerIntersil
SeriesLQFP
Part NumberQ128.14x20A

128 Lead Low Quad Flatpack with Top Exposed Pad (LQFP-TEP)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Low Plastic Quad Flatpack Package with Top Exposed Pad (LQFP-TEP)
    Q128.14x20A 4
    D
    NOTE: EXPOSED PAD 128 Lead Low Quad Flatpack with Top Exposed Pad D/2
    D MILLIMETERS 3 BHB
    3 SYMBOL A
    B 3 D2 E 4 e
    E2 N/4 TIPS
    0.20 C A-B D 4X SEE DETAIL "A" TOP VIEW
    5 7
    D1/2 XX U NT RY E1/2
    5 -1.60 0.05 -0.15 A2 1.35 1.40 1.45 7
    E1 NOTES
    13 22 BSC 4 D1 20 BSC 7, 8 D2 12.50 BSC 14 E 16 BSC 4 E1 14 BSC 7, 8 L CO MAX A E2 D1 NOM A1
    D E/2 PIN 1 ID MIN 6.5 BSC
    0.45 0.60 N 128 e 0.50 BSC 14
    0.75 b 0.17 0.22 0.27 b1 0.17 0.20 0.23 ccc 0.08 ddd 0.08 9 Rev. 1 7/11
    4X NOTES: BOTTOM VIEW 0.20 H A-B D 1. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 8 PLACES
    11/13В° 2. Datum plane H located at mold parting line and coincident with
    lead, where lead exits plastic body at bottom of parting line. A
    H 0.05 2 / / 0.10 C ccc C 4. To be determined at seating plane C. SEE DETAIL "B" 5. Dimensions D1 and E1 do not include mold protrusion. Allowable
    mold protrusion is 0.254mm per side on D1 and E1 dimensions. ddd M C A-B S D S 9 WITH LEAD FINISH b 0.09/0.20 6. “N” is the total number of terminals. ...

Parametrics

FamilyLQFP
Pin Count128
Length20.00 mm
Width14.00 mm
Thickness1.40 mm
Height max1.60 mm
Weight0.9839 g
Pitch0.50 mm
Peak Temperature225 °C
Lead Free Peak Temperature260 °C
Package IndexQ128.14X20A

Moldel Line

Series: LQFP (19)

Manufacturer's Classification

  • Plastic Packages
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