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Package Intersil Q64.7x7

Package Intersil Q64.7x7

ManufacturerIntersil
SeriesLQFP
Part NumberQ64.7x7

64 Lead Low Plastic Quad Flatpack Package (LQFP)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Low Plastic Quad Flatpack Packages (LQFP)
    Q64.7x7 (JEDEC MS-026BBD ISSUE C)
    64 LEAD LOW PLASTIC QUAD FLATPACK PACKAGE D
    D1
    -D-INCHES -B-AE E1 e
    PIN 1
    SEATING
    A PLANE -H-0.08
    0.003
    -C0.07
    M
    0.003 b 0.020
    0.008 MIN b1 A2 A1 GAGE
    PLANE
    L
    0o-7o 11o-13o 0.25
    0.010 1 SYMBOL MIN MAX MIN MAX NOTES A -0.062 -1.60 -A1 0.002 0.005 0.05 0.15 -A2 0.054 0.057 1.35 1.45 -b 0.005 0.009 0.13 0.23 6 b1 0.005 0.007 0.13 0.19 -D 0.350 0.358 8.90 9.10 3 D1 0.272 0.280 6.90 7.10 4, 5 E 0.350 0.358 8.90 9.10 3 E1 0.272 0.280 6.90 7.10 4, 5 L 0.018 0.029 0.45 0.75 N 64 64 e 0.0157 BSC 0.40 BSC 7
    Rev. 2 7/11 NOTES:
    1. Controlling dimension: MILLIMETER. Converted inch
    dimensions are not necessarily exact.
    2. All dimensions and tolerances per ANSI Y14.5M-1982.
    3. Dimensions D and E to be determined at seating plane -C-. D S C A-B S 11o-13o 0o MIN MILLIMETERS 4. Dimensions D1 and E1 to be determined at datum plane ...

Parametrics

FamilyLQFP
Pin Count64
Thickness1.40 mm
Height max1.60 mm
Weight0.182 g
Pitch0.40 mm
Peak Temperature235 °C
Lead Free Peak Temperature260 °C
Package IndexQ64.7X7

Moldel Line

Series: LQFP (19)

Manufacturer's Classification

  • Plastic Packages
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