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Package Intersil Y22.15x15

Package Intersil Y22.15x15

ManufacturerIntersil
SeriesMODULE
Part NumberY22.15x15

22 I/O 15mm x 15mm x 3.6mm Custom HDA Module

Package Outline Drawing (POD)

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    Package Outline Drawing
    Y22.15x15
    22 I/O 15mmx15mmx3.6mm CUSTOM HDA MODULE
    Rev 2, 9/13
    PIN 1 INDICATOR
    C = 0.35 DATUM A
    13.00 15.00 A B 1 5.00 7.30 0.10 C 2X
    0.10 C 2X 13.60 В±0.15
    fff
    CAB TOP VIEW DATUM B
    0.50 BOTTOM VIEW
    1.50 3.7 MAX
    0.10 C 0.10
    0.10 4 17x (0.60В±0.05) 0.08 C
    MAX 0.025 DETAIL B C A B
    C SEATING PLANE SIDE VIEW C 3 1.00 NOTES:
    1. All dimensions are in millimeters. 2. All tolerances В± 0.10mm, unless otherwise noted. 3. Represents the basic land grid pitch. 4. The total number of smaller I/O pads is 17. All 17
    I/O’s are centered in a fixed row and column matrix
    at 1.0mm pitch BSC. 5. Dimensioning and tolerancing per ASME Y14.5M-1994. 6. Tolerance for exposed DAP edge location dimension. 1.00
    1.00 4 17x (0.60В±0.05)
    1.00 TERMINAL TIP DETAIL A 3 Plastic Packages for Integrated Circuits A
    B
    C ...

Parametrics

FamilyModule
Pin Count22
Length15.00 mm
Width15.00 mm
Thickness3.60 mm
Height max3.70 mm
Weight2.325 g
Pitch1.00 mm
Peak Temperature220 °C
Lead Free Peak Temperature245 °C
Package IndexY22.15X15

Moldel Line

Series: MODULE (13)

Manufacturer's Classification

  • Plastic Packages
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