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Package Intersil Y32.17.2x11.45

Package Intersil Y32.17.2x11.45

ManufacturerIntersil
SeriesMODULE
Part NumberY32.17.2x11.45

32 I/O 17.2mm x 11.45mm x 2.5mm HDA Module

Package Outline Drawing (POD)

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    Package Outline Drawing
    Y32.17.2x11.45
    32 I/O 17.2mm x 11.45mm x 2.5mm HDA MODULE
    Rev 1, 11/12
    PIN A1 INDICATOR
    C = 0.35 7.00
    DATUM A
    17.20 A TERMINAL #A1
    INDEX AREA B SEE DETAIL B 1 0.10 0.10 C 2X 16.50±0.15
    0.10
    C AB 0.10 C 2X TOP VIEW 0.90±0.10 DATUM B BOTTOM VIEW
    1.00 0.18±0.10
    2.50 MAX
    0.10 C
    0.08 C 1.00 SEATING PLANE 0.025 MAX SIDE VIEW C
    3 0.10 C A B
    0.05 C
    27x(0.60±0.05) 0.55±0.10 NOTES:
    1. All dimensions are in millimeters. 2. 1.0mmx1.0mm represents the basic land grid pitch. 3. “27” is the total number of I/O (excluding large pads).
    All 27 I/O’s are centered in a fixed row and column
    matrix at 1.0mm pitch BSC. 4. Dimensioning and tolerancing per ASME Y14.5M-1994. 5. Tolerance for exposed DAP edge location dimension on
    page 2 is ±0.1mm. 2.00 0.55±0.10
    3 DETAIL B 27x(0.60±0.05) 1.00 TERMINAL TIP 0.95 ...

Parametrics

FamilyModule
Pin Count32
Length17.20 mm
Width11.45 mm
Thickness2.40 mm
Height max2.50 mm
Weight1.331 g
Pitch1.00 mm
Peak Temperature220 °C
Lead Free Peak Temperature250 °C
Package IndexY32.17.2X11.45

Moldel Line

Series: MODULE (13)

Manufacturer's Classification

  • Plastic Packages
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