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Package Intersil Y58.18x23

Package Intersil Y58.18x23

ManufacturerIntersil
SeriesMODULE
Part NumberY58.18x23

58 I/O 18mmx23mmx7.5mm CUSTOM HDA MODULE

Package Outline Drawing (POD)

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    Package Outline Drawing
    Y58.18x23
    58 I/O 18mmx23mmx7.5mm CUSTOM HDA MODULE
    Rev 3, 12/16
    18.00 A DATUM A B 18 17 16 1514 13 12 1110 9 8 7 6 5 4 3 2 1 TERMINAL #A1
    INDEX AREA
    (9x11.5) 1
    23.00 0.10 M C A B
    22.60 В± 0.15 0.10 C 2X 0.40 REF DATUM B 16.00 0.10 C 2X 17.20
    TOP VIEW 0.10 M C A B
    BOTTOM VIEW 7.50 MAX
    0.10 C 2 0.20 REF 1.00 0.20 REF SEATING PLANE 0.08 C C MAX 0.025
    SIDE VIEW
    NOTES:
    1. All dimensions are in millimeters. 2. Represents the basic land grid pitch. 3. These 42 I/Os are centered in a fixed row and column matrix
    at 1.0mm pitch BSC. 42 x 0.60 В± 0.05 4. Dimensioning and tolerancing per ASME Y14.5-2009. 3 5. Tolerance for exposed PAD edge location dimension on
    page 3 is В±0.1mm. 3
    42 x 0.60 В± 0.05 0.10 M C A B
    0.05 M C TERMINAL TIP
    0.100 R REF 1.00
    DETAIL A 2 Plastic Packages for Integrated Circuits 12.00 A
    B
    C ...

Parametrics

FamilyModule
Pin Count58
Length23.00 mm
Width18.00 mm
Thickness7.45 mm
Height max7.50 mm
Weight10.3973 g
Pitch1.00 mm
Peak Temperature220 °C
Lead Free Peak Temperature245 °C
Package IndexY58.18X23

Moldel Line

Series: MODULE (13)

Manufacturer's Classification

  • Plastic Packages
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