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Package Intersil MDP0055

Package Intersil MDP0055

ManufacturerIntersil
SeriesMQFP
Part NumberMDP0055

14 x 20 mm 128 Lead MQFP with Heat Spreader , 3.2 mm Footprint

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Metric Plastic Quad Flatpack Packages (MQFP)
    D MDP0055 D1 14x20mm 128 LEAD MQFP (WITH AND WITHOUT HEAT
    SPREADER) 3.2mm FOOTPRINT 128
    PIN 1 ID
    1 DIMENSIONS
    (MILLIMETERS) A Max 3.40 20.000 ±0.100
    (E1) 19.870 ±0.100 18.500 REF E1 E SYMBOL 12.500 REF C0.600x0.350
    (4X) 13.870 ±0.100
    A 1 A 14.000 ±0.100
    (D1) 12° ALL
    AROUND Y
    b T1 T REMARKS
    Overall height A1 0.250~0.500 Standoff A2 2.750 ±0.250 Package thickness α 0°~7° b 0.220 ±0.050 Foot angle b1 0.200 ±0.030 D 17.200 ±0.250 Lead width 1
    Lead base metal width 1
    Lead tip to tip D1 14.000 ±0.100 Package length E 23.200 ±0.250 Lead tip to tip E1 20.000 ±0.100 Package width e 0.500 Base Lead pitch L 0.880 ±0.150 Foot length L1 1.600 Ref. Lead length T 0.170 ±0.060 Frame thickness 1 T1 0.152 ±0.040 ccc 0.100 Frame base metal thickness 1
    Foot coplanarity ddd 0.100 Foot position
    Rev. 2 2/07 b1 NOTES: 1 SECTION A-A DROP IN HEAT SPREADER
    4 STAND POINTS EXPOSED 1. General tolerance: Distance ±0.100, Angle +2.5°.
    2. 1 Matte finish on package body surface except ejection and
    pin 1 marking (Ra 0.8~2.0um). 3. All molded body sharp corner RADII unless otherwise specified
    (Max RO.200).
    4. Package/Leadframe misalignment (X, Y): Max. 0.127 ...

Parametrics

FamilyMQFP
Pin Count128
Length20.00 mm
Width14.00 mm
Thickness2.75 mm
Height max3.40 mm
Weight1.7 g
Pitch0.50 mm
Peak Temperature225 °C
Lead Free Peak Temperature260 °C
Package IndexMDP0055

Moldel Line

Series: MQFP (6)

Manufacturer's Classification

  • Plastic Packages

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