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Package Intersil MDP0050

ManufacturerIntersil
SeriesMSOP
Part NumberMDP0050

HMSOP (Heat-Sink MSOP)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    HMSOP (Heat-Sink MSOP) Package Family
    E
    B 0.25 M C A B E1 MDP0050
    HMSOP (HEAT-SINK MSOP) PACKAGE FAMILY
    MILLIMETERS 1 N SYMBOL
    D
    (N/2)+1 (N/2) PIN #1
    I.D. A HMSOP8 HMSOP10 TOLERANCE NOTES A 1.00 1.00 Max. -A1 0.075 0.075 +0.025/-0.050 -A2 0.86 0.86 В±0.09 -b 0.30 0.20 +0.07/-0.08 -c 0.15 0.15 В±0.05 -D 3.00 3.00 В±0.10 1, 3 D1 1.85 1.85 Reference -E 4.90 4.90 В±0.15 -E1 3.00 3.00 В±0.10 2, 3 E2 1.73 1.73 Reference -e 0.65 0.50 Basic -L 0.55 0.55 В±0.15 -L1 0.95 0.95 Basic -N 8 10 Reference -TOP VIEW E2 EXPOSED
    THERMAL PAD D1 BOTTOM VIEW Rev. 1 2/07
    e NOTES: H 1. Plastic or metal protrusions of 0.15mm maximum per side are not
    included. C
    SEATING
    PLANE 2. Plastic interlead protrusions of 0.25mm maximum per side are
    not included.
    0.08 M C A B b 0.10 C
    N LEADS 4. Dimensioning and tolerancing per ASME Y14.5M-1994. SIDE VIEW L1
    A
    c
    END VIEW SEE DETAIL "X" A2
    GAUGE
    0.25 PLANE
    L ...

Parametrics

FamilyMSOP-EP
Length3.00 mm
Width3.00 mm
Height max1.00 mm
Weight0.026 g
Lead Free Peak Temperature260 °C
FeaturesExposed Pad
Package IndexMDP0050

Moldel Line

Series: MSOP (6)

Manufacturer's Classification

  • Plastic Packages

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