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Package Intersil L4.2.00x1.25

ManufacturerIntersil
SeriesODFN
Part NumberL4.2.00x1.25

4 LD OPTICAL CHIP ON BOARD PACKAGE (COB)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L4.2.00x1.25
    4 LD OPTICAL CHIP ON BOARD PACKAGE (COB)
    Rev 3, 2/14 PIN 1
    INDEX AREA 1.1
    4 1 0.360 0.100 1.25 В± 0.05 1.00 В± 0.10 0.700
    0.550 2.00 В± 0.05
    PIN 3
    EXTENDED PAD TOP VIEW PIN 3
    EXTENDED PAD 0.450 2 3 0.330 1 BOTTOM VIEW PACKAGE OUTLINE
    3x 0.700 1.1 0.100
    4x 0.360 2x 0.700
    1 0.800 TYPICAL RECOMMENDED LAND PATTERN NOTES: 1 1. Dimensions are in millimeters.
    Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal В± 0.05 4. Pin 1 is diagonal to extended Pad Pin 3 on bottom surface. ...

Parametrics

FamilyODFN
Pin Count4
Length1.25 mm
Width2.00 mm
Height max0.04 mm
Weight0.1207 g
Pitch0.03 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL4.2.00X1.25

Moldel Line

Series: ODFN (16)

Manufacturer's Classification

  • Plastic Packages
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