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Package Intersil L5.2x2.1

Package Intersil L5.2x2.1

ManufacturerIntersil
SeriesODFN
Part NumberL5.2x2.1

5 Lead Optical Dual Flat No-Lead Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L5.2x2.1
    5 LEAD OPTICAL DUAL FLAT NO-LEAD PLASTIC PACKAGE
    Rev 2, 4/15 2.10 6
    PIN #1 INDEX AREA A
    B 6
    PIN 1
    INDEX AREA 1
    5
    1 2.00 1.35 1.30 REF 2
    0.65
    0.30В±0.05 (4X) 4
    3 0.10
    0.65 0.10 M C A B 5X 0 . 35 В± 0 . 05 TOP VIEW BOTTOM VIEW (0.65) SEE DETAIL "X"
    0.10 C
    0 . 7 В± 0 . 05 C ( 5X 0 . 30 ) (0.65) BASE PLANE (1.35) SEATING PLANE
    0.08 C SIDE VIEW ( 5X 0 . 55 ) C 0 . 2 REF 5 (1.95)
    0 . 00 MIN.
    0 . 05 MAX.
    DETAIL "X" TYPICAL RECOMMENDED LAND PATTERN NOTES: 1 1. Dimensions are in millimeters.
    Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal В± 0.05 4. Dimension b applies to the metallized terminal and is measured
    between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature and may
    be located on any of the 4 sides (or ends). 6. The configuration of the pin #1 identifier is optional, but must be ...

Parametrics

FamilyODFN
Pin Count5
Length2.00 mm
Width2.10 mm
Height max0.75 mm
Weight0.0070 g
Pitch0.65 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL5.2X2.1

Moldel Line

Series: ODFN (16)

Manufacturer's Classification

  • Plastic Packages
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