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Package Intersil L7.2.0x3.4

Package Intersil L7.2.0x3.4

ManufacturerIntersil
SeriesODFN
Part NumberL7.2.0x3.4

7 LEAD OPTICAL CO-PACKAGE

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L7.2.0x3.4
    7 LEAD OPTICAL CO-PACKAGE
    Rev 0, 5/14 2.0 ±0.050
    0.25 INCLUDED L/F THICKNESS 0.2mm
    1 ±0.100 0.373
    R 0.25 0.45
    0.75
    0.45
    7
    1.2 3.4 ±0.050
    1.365
    83° DAP
    0.808 6 0.3 1
    2 5
    1.55 7x 0.2 0.45 3 4 0.35
    10° 0.323 0.35 0.884 0.875 1 TOP VIEW SIDE VIEW/ DETAIL 0.558 SIDE VIEW R 0.375 BOTTOM VIEW PACKAGE OUTLINE
    0.75 1.2 0.45 0.2
    0.35
    0.25 0.808 TYPICAL RECOMMENDED LAND PATTERN NOTES: 1 1. Dimensions are in millimeters.
    Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Pin #1 identifier is a feature on the bottom surface. 5. No routing allowed underneath the die attach paddle (DAP) area. ...

Parametrics

FamilyHODFN
Pin Count7
Length3.40 mm
Width2.00 mm
Thickness1.00 mm
Height max1.10 mm
Pitch0.45 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL7.2.0X3.4

Moldel Line

Series: ODFN (16)

Manufacturer's Classification

  • Plastic Packages
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