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Package Intersil L8.2.1x2.0

Package Intersil L8.2.1x2.0

ManufacturerIntersil
SeriesODFN
Part NumberL8.2.1x2.0

8 Lead Optical Dual Flat No-lead Plastic Package (ODFN)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L8.2.1x2.0
    8 LEAD OPTICAL DUAL FLAT NO-LEAD PLASTIC PACKAGE (ODFN)
    Rev 4, 5/15
    2.10 A
    6
    PIN 1
    INDEX AREA 0.15
    B
    0.25
    6
    PIN 1
    INDEX AREA 0.50 1.50 2.00 1.50
    0.20В±0.05 4 (2X) 0.10 M C A B 0.10
    8X 0 . 35 В± 0 . 05 TOP VIEW 0.75
    BOTTOM VIEW SEE DETAIL "X" 2.50 0.10 C
    2.10 0.70В±0.05 C
    BASE PLANE
    SEATING PLANE
    0.08 C SIDE VIEW
    (6x0.50) (1.50) (8x0.20) C
    (8x0.20) 5 0 . 00 MIN.
    0 . 05 MAX. (8x0.55) DETAIL "X" (0.75) ...

Parametrics

FamilyODFN
Pin Count8
Length2.00 mm
Width2.10 mm
Thickness0.70 mm
Height max0.75 mm
Weight0.00715 g
Pitch0.50 mm
Lead Free Peak Temperature260 °C
Package IndexL8.2.1X2.0

Moldel Line

Series: ODFN (16)

Manufacturer's Classification

  • Plastic Packages
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