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Package Intersil L20.6x6B

Package Intersil L20.6x6B

ManufacturerIntersil
SeriesQFN
Part NumberL20.6x6B

20 Lead Quad Flat No-Lead Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Quad Flat No-Lead Plastic Package (QFN)
    Micro Lead Frame Plastic Package (MLFP) L20.6x6B
    20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
    (COMPLIANT TO JEDEC MO-220VJJB ISSUE C)
    MILLIMETERS
    SYMBOL MIN NOMINAL MAX NOTES A 0.80 0.90 1.00 -A1 -0.05 -A2 -1.00 9 0.38 5, 8 A3
    b 0.20 REF
    0.28 0.33 9 D 6.00 BSC -D1 5.75 BSC 9 D2 3.33 E
    E1
    E2 3.43 3.53 7, 8 6.00 BSC -5.75 BSC
    3.33 e 3.43 9
    3.53 7, 8
    -0.80 BSC -k 0.635 -L 0.50 0.60 0.70 8 L1 -0.15 10 N 20 2 Nd 5 3 Ne 5 3 P -0.60 Оё -12 9
    9
    Rev. 0 12/04 NOTES:
    1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
    2. N is the number of terminals.
    3. Nd and Ne refer to the number of terminals on each D and E.
    4. All dimensions are in millimeters. Angles are in degrees.
    5. Dimension b applies to the metallized terminal and is measured
    between 0.15mm and 0.30mm from the terminal tip.
    6. The configuration of the pin #1 identifier is optional, but must be ...

Parametrics

FamilyQFN
Pin Count20
Length6.00 mm
Width6.00 mm
Thickness1.00 mm
Height max1.00 mm
Weight0.097 g
Pitch0.80 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL20.6X6B

Moldel Line

Series: QFN (100 from 124)

Manufacturer's Classification

  • Plastic Packages
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